Studies of thick-film solder joint reliability and capacitors buried in an LTCC substrate
厚膜焊點的可靠性及 LTCC 陶瓷基板內嵌電容的硏究
Student thesis: Doctoral Thesis
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Detail(s)
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| Award date | 30 Jul 1999 |
Link(s)
| Permanent Link | https://scholars.cityu.edu.hk/en/theses/theses(4a9e479e-0e53-488c-8212-b5073ac417ea).html |
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| Other link(s) | Links |
- Materials, Electronic ceramics, Electronic packaging
