Full wave analysis of microstrip structures : densely packed interconnects and interconnects over a periodically perforated ground plane

微帶結構的全波分析 : 密集封裝的互連及週期有孔地板上的互連

Student thesis: Doctoral Thesis

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Author(s)

  • Yongxue YU

Related Research Unit(s)

Detail(s)

Awarding Institution
Supervisors/Advisors
Award date15 Oct 1999

    Research areas

  • Electronic packaging