Study on non-ACF flip chip bonding for fine pitch chip-on-film (COF) package

Tak Chi CHAU

Department of Electrical Engineering

Student thesis: Master's Thesis

Date of Award	14 Jul 2006
Original language	English
Awarding Institution	City University of Hong Kong
Supervisor	Yan Cheong CHAN (Supervisor)

Keywords

Flip chip technology
Microelectronic packaging
Chip scale packaging

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