Study of Cu-Sn intermetallic compounds in surface mount solder joint

Chun Kwan SO

Department of Electrical Engineering

Student thesis: Doctoral Thesis

Date of Award	15 Feb 2002
Original language	English
Awarding Institution	City University of Hong Kong
Supervisor	Yan Cheong CHAN (Supervisor)

Keywords

Copper-tin alloys
Surface mount technology
Intermetallic compounds
Electronic packaging

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