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Full wave analysis of microstrip structures
: densely packed interconnects and interconnects over a periodically perforated ground plane

  • Yongxue YU

Student thesis: Doctoral Thesis

Date of Award15 Oct 1999
Original languageEnglish
Awarding Institution
  • City University of Hong Kong
SupervisorChi Hou CHAN (Supervisor)

Keywords

  • Electronic packaging

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