Characterization of gold-tin (Au-Sn) inner lead bonds (ILB) in tape automated bonding (TAB) technology

  • Ming Chau LOO

    Student thesis: Master's Thesis

    Date of Award2 Apr 1996
    Original languageEnglish
    Awarding Institution
    • City University of Hong Kong
    SupervisorKi Leuk Joseph LAI (Supervisor)

    Keywords

    • Metal bonding
    • Electronic packaging

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