Skip to main navigation Skip to search Skip to main content

Characterization of conductive adhesives in chip-on-glass/flex technolgoy

  • Man Lai Manly CHAU

    Student thesis: Master's Thesis

    Date of Award3 Oct 2001
    Original languageEnglish
    Awarding Institution
    • City University of Hong Kong
    SupervisorLawrence WU (Supervisor)

    Keywords

    • Adhesives
    • Electronic packaging
    • Adhesive joints
    • Electric conductivity

    Cite this

    Links

    '