Wire bonding dynamics monitoring by wavelet analysis

Lei Han; Rongzhi Gao; Jue Zhong; Hanxiong Li

doi:10.1016/j.sna.2007.02.041

Wire bonding dynamics monitoring by wavelet analysis

Lei Han, Rongzhi Gao, Jue Zhong, Hanxiong Li

City University of Hong Kong

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

16 Citations (Scopus)

Abstract

Aluminum wire bonding was performed on a lab test-bed with PZT transducer device. Vibration behavior of bonder transducer was monitored, and the correlations between bonding pressure, high frequency tool vibrations, and average bond strength were then demonstrated to determine the statistically significant differences among them. Wavelet decomposing, combined with statistics-based data processing, was utilized to explore the details of bonding process and evade inherent bonding uncertainties. Experimental results show that the method is practical and effective even if the interactions between transducer and its bonding target are very small. The obtained time-frequency plots were depicted for identifying un-modeled wire bonding dynamics. © 2007 Elsevier B.V. All rights reserved.

Original language	English
Pages (from-to)	41-50
Journal	Sensors and Actuators, A: Physical
Volume	137
Issue number	1
DOIs	https://doi.org/10.1016/j.sna.2007.02.041
Publication status	Published - 12 Jun 2007

Research Keywords

Statistics-based data processing
Transducer
Ultrasonic bonding
Wavelet analysis

Access Output

10.1016/j.sna.2007.02.041

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@article{06d6844ca37d453fac1b74ad41c0b133,

title = "Wire bonding dynamics monitoring by wavelet analysis",

abstract = "Aluminum wire bonding was performed on a lab test-bed with PZT transducer device. Vibration behavior of bonder transducer was monitored, and the correlations between bonding pressure, high frequency tool vibrations, and average bond strength were then demonstrated to determine the statistically significant differences among them. Wavelet decomposing, combined with statistics-based data processing, was utilized to explore the details of bonding process and evade inherent bonding uncertainties. Experimental results show that the method is practical and effective even if the interactions between transducer and its bonding target are very small. The obtained time-frequency plots were depicted for identifying un-modeled wire bonding dynamics. {\textcopyright} 2007 Elsevier B.V. All rights reserved.",

keywords = "Statistics-based data processing, Transducer, Ultrasonic bonding, Wavelet analysis",

author = "Lei Han and Rongzhi Gao and Jue Zhong and Hanxiong Li",

year = "2007",

month = jun,

day = "12",

doi = "10.1016/j.sna.2007.02.041",

language = "English",

volume = "137",

pages = "41--50",

journal = "Sensors and Actuators, A: Physical",

issn = "0924-4247",

publisher = "Elsevier B.V.",

number = "1",

}

TY - JOUR

T1 - Wire bonding dynamics monitoring by wavelet analysis

AU - Han, Lei

AU - Gao, Rongzhi

AU - Zhong, Jue

AU - Li, Hanxiong

PY - 2007/6/12

Y1 - 2007/6/12

N2 - Aluminum wire bonding was performed on a lab test-bed with PZT transducer device. Vibration behavior of bonder transducer was monitored, and the correlations between bonding pressure, high frequency tool vibrations, and average bond strength were then demonstrated to determine the statistically significant differences among them. Wavelet decomposing, combined with statistics-based data processing, was utilized to explore the details of bonding process and evade inherent bonding uncertainties. Experimental results show that the method is practical and effective even if the interactions between transducer and its bonding target are very small. The obtained time-frequency plots were depicted for identifying un-modeled wire bonding dynamics. © 2007 Elsevier B.V. All rights reserved.

AB - Aluminum wire bonding was performed on a lab test-bed with PZT transducer device. Vibration behavior of bonder transducer was monitored, and the correlations between bonding pressure, high frequency tool vibrations, and average bond strength were then demonstrated to determine the statistically significant differences among them. Wavelet decomposing, combined with statistics-based data processing, was utilized to explore the details of bonding process and evade inherent bonding uncertainties. Experimental results show that the method is practical and effective even if the interactions between transducer and its bonding target are very small. The obtained time-frequency plots were depicted for identifying un-modeled wire bonding dynamics. © 2007 Elsevier B.V. All rights reserved.

KW - Statistics-based data processing

KW - Transducer

KW - Ultrasonic bonding

KW - Wavelet analysis

UR - http://www.scopus.com/inward/record.url?scp=34249328091&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-34249328091&origin=recordpage

U2 - 10.1016/j.sna.2007.02.041

DO - 10.1016/j.sna.2007.02.041

M3 - RGC 21 - Publication in refereed journal

SN - 0924-4247

VL - 137

SP - 41

EP - 50

JO - Sensors and Actuators, A: Physical

JF - Sensors and Actuators, A: Physical

IS - 1

ER -

Wire bonding dynamics monitoring by wavelet analysis

Abstract

Research Keywords

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this