TY - JOUR
T1 - Wetting reaction versus solid state aging of eutectic SnPb on Cu
AU - Tu, K. N.
AU - Lee, T. Y.
AU - Jang, J. W.
AU - Li, L.
AU - Frear, D. R.
AU - Zeng, K.
AU - Kivilahti, J. K.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2001/5/1
Y1 - 2001/5/1
N2 - The reaction kinetics of eutectic SnPb solder on Cu were studied and compared in the liquid state at 200 to 240°C and in the solid state aged at 125-170°C. The ternary phase diagrams of SnPbCu, the morphology of intermetallic compound (IMC), and the kinetics of growth of the intermetallics were used in the comparison. The temperature difference between these two reactions is only 30°C, but the kinetics of reaction, as well as the morphology of IMC formation, are very different. The kinetics in the wetting reaction is four orders of magnitude faster than that in solid state aging. The Cu6Sn5 intermetallic morphology in solid state aging is a layer type, but it has a scallop-type morphology in the wetting reaction. The morphology strongly affects the kinetics. While the kinetic difference can be attributed to the difference in atomic diffusivity between the liquid state and the solid state, it is the morphology that determines the kinetic path in these reactions. We conclude that a fast rate of reaction, which leads to a high rate of Gibbs free energy change, controls the reaction, not the Gibbs free energy change itself. © 2001 American Institute of Physics.
AB - The reaction kinetics of eutectic SnPb solder on Cu were studied and compared in the liquid state at 200 to 240°C and in the solid state aged at 125-170°C. The ternary phase diagrams of SnPbCu, the morphology of intermetallic compound (IMC), and the kinetics of growth of the intermetallics were used in the comparison. The temperature difference between these two reactions is only 30°C, but the kinetics of reaction, as well as the morphology of IMC formation, are very different. The kinetics in the wetting reaction is four orders of magnitude faster than that in solid state aging. The Cu6Sn5 intermetallic morphology in solid state aging is a layer type, but it has a scallop-type morphology in the wetting reaction. The morphology strongly affects the kinetics. While the kinetic difference can be attributed to the difference in atomic diffusivity between the liquid state and the solid state, it is the morphology that determines the kinetic path in these reactions. We conclude that a fast rate of reaction, which leads to a high rate of Gibbs free energy change, controls the reaction, not the Gibbs free energy change itself. © 2001 American Institute of Physics.
UR - http://www.scopus.com/inward/record.url?scp=0035339984&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0035339984&origin=recordpage
U2 - 10.1063/1.1357469
DO - 10.1063/1.1357469
M3 - RGC 21 - Publication in refereed journal
SN - 0021-8979
VL - 89
SP - 4843
EP - 4849
JO - Journal of Applied Physics
JF - Journal of Applied Physics
IS - 9
ER -