Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

  • C. Y. Liu
  • J. Li
  • G. J. Vandentop
  • W. J. Choi
  • K. N. Tu

Detail(s)

Original languageEnglish
Article number92
Pages (from-to)521-525
Journal / PublicationJournal of Electronic Materials
Volume30
Issue number5
Publication statusPublished - 2001
Externally publishedYes

Abstract

The wetting behavior of SnAg based Pb-free solders on Cu and Cu substrates plated with Au, Pd, and Au/Pd thin films have been studied. The wetting angle and kinetics of interfacial reaction were measured. The Au-plated substrates exhibit better wetting than the Pd-plated substrates. In the case of SnAg on Pd-plated Cu, SEM observation revealed that the solder cap was surrounded by an inner ring of Cu-Sn compound and an outer ring of Pd-Sn compound. This implies that the molten SnAg solder had removed the Pd and wetted the Cu directly in the equilibrium state. The effects of pre-doping Cu in the SnAg solder on wetting behavior were also investigated. We found that wettability decreases with increasing Cu content in the solder. We also observed that the SnAgCu solders have a lower Cu consumption rate that the SnAg solder.

Research Area(s)

  • Pb-free solder, SnAg Solder, Wetting reaction

Bibliographic Note

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Citation Format(s)

Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer. / Liu, C. Y.; Li, J.; Vandentop, G. J. et al.
In: Journal of Electronic Materials, Vol. 30, No. 5, 92, 2001, p. 521-525.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review