Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

C. Y. Liu; J. Li; G. J. Vandentop; W. J. Choi; K. N. Tu

doi:10.1007/s11664-001-0092-1

Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

C. Y. Liu
, J. Li
, G. J. Vandentop
, W. J. Choi
, K. N. Tu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

22 Citations (Scopus)

Abstract

The wetting behavior of SnAg based Pb-free solders on Cu and Cu substrates plated with Au, Pd, and Au/Pd thin films have been studied. The wetting angle and kinetics of interfacial reaction were measured. The Au-plated substrates exhibit better wetting than the Pd-plated substrates. In the case of SnAg on Pd-plated Cu, SEM observation revealed that the solder cap was surrounded by an inner ring of Cu-Sn compound and an outer ring of Pd-Sn compound. This implies that the molten SnAg solder had removed the Pd and wetted the Cu directly in the equilibrium state. The effects of pre-doping Cu in the SnAg solder on wetting behavior were also investigated. We found that wettability decreases with increasing Cu content in the solder. We also observed that the SnAgCu solders have a lower Cu consumption rate that the SnAg solder.

Original language	English
Article number	92
Pages (from-to)	521-525
Journal	Journal of Electronic Materials
Volume	30
Issue number	5
DOIs	https://doi.org/10.1007/s11664-001-0092-1
Publication status	Published - 2001
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

Pb-free solder
SnAg Solder
Wetting reaction

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title = "Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer",

abstract = "The wetting behavior of SnAg based Pb-free solders on Cu and Cu substrates plated with Au, Pd, and Au/Pd thin films have been studied. The wetting angle and kinetics of interfacial reaction were measured. The Au-plated substrates exhibit better wetting than the Pd-plated substrates. In the case of SnAg on Pd-plated Cu, SEM observation revealed that the solder cap was surrounded by an inner ring of Cu-Sn compound and an outer ring of Pd-Sn compound. This implies that the molten SnAg solder had removed the Pd and wetted the Cu directly in the equilibrium state. The effects of pre-doping Cu in the SnAg solder on wetting behavior were also investigated. We found that wettability decreases with increasing Cu content in the solder. We also observed that the SnAgCu solders have a lower Cu consumption rate that the SnAg solder.",

keywords = "Pb-free solder, SnAg Solder, Wetting reaction",

author = "Liu, \{C. Y.\} and J. Li and Vandentop, \{G. J.\} and Choi, \{W. J.\} and Tu, \{K. N.\}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

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doi = "10.1007/s11664-001-0092-1",

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TY - JOUR

T1 - Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

AU - Liu, C. Y.

AU - Li, J.

AU - Vandentop, G. J.

AU - Choi, W. J.

AU - Tu, K. N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2001

Y1 - 2001

N2 - The wetting behavior of SnAg based Pb-free solders on Cu and Cu substrates plated with Au, Pd, and Au/Pd thin films have been studied. The wetting angle and kinetics of interfacial reaction were measured. The Au-plated substrates exhibit better wetting than the Pd-plated substrates. In the case of SnAg on Pd-plated Cu, SEM observation revealed that the solder cap was surrounded by an inner ring of Cu-Sn compound and an outer ring of Pd-Sn compound. This implies that the molten SnAg solder had removed the Pd and wetted the Cu directly in the equilibrium state. The effects of pre-doping Cu in the SnAg solder on wetting behavior were also investigated. We found that wettability decreases with increasing Cu content in the solder. We also observed that the SnAgCu solders have a lower Cu consumption rate that the SnAg solder.

AB - The wetting behavior of SnAg based Pb-free solders on Cu and Cu substrates plated with Au, Pd, and Au/Pd thin films have been studied. The wetting angle and kinetics of interfacial reaction were measured. The Au-plated substrates exhibit better wetting than the Pd-plated substrates. In the case of SnAg on Pd-plated Cu, SEM observation revealed that the solder cap was surrounded by an inner ring of Cu-Sn compound and an outer ring of Pd-Sn compound. This implies that the molten SnAg solder had removed the Pd and wetted the Cu directly in the equilibrium state. The effects of pre-doping Cu in the SnAg solder on wetting behavior were also investigated. We found that wettability decreases with increasing Cu content in the solder. We also observed that the SnAgCu solders have a lower Cu consumption rate that the SnAg solder.

KW - Pb-free solder

KW - SnAg Solder

KW - Wetting reaction

UR - https://www.scopus.com/pages/publications/0035332210

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U2 - 10.1007/s11664-001-0092-1

DO - 10.1007/s11664-001-0092-1

M3 - RGC 21 - Publication in refereed journal

SN - 0361-5235

VL - 30

SP - 521

EP - 525

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 5

M1 - 92

ER -

Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

Abstract

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Research Keywords

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