TY - GEN
T1 - Wetting and interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder
AU - Islam, M. N.
AU - Chan, Y. C.
PY - 2005
Y1 - 2005
N2 - The world is moving toward 'green products' for electronic devices and components due to toxicity of Pb. In this paper two types of solder paste such as Sn-9Zn (eutectic) and Sn-8Zn-3Bi (noneutectic) have been investigated along with Sn-37Pb (eutectic) solder for reference. The variation of dissolution of Cu layer and IMCs with reflow time shows different characteristics for eutectic and non-eutectic solder pastes. The morphologies of the IMCs are quite different for different solder compositions. During as reflowed, the growth rate of IMCs in the Sn-Zn based solder is higher than the Sn-Pb solders. Different types of IMCs such as γ- Cu5Zn8, β-CuZn and thin unknown Cu-Zn layer are formed in the Sn-Zn based solder but in case of Sn-Pb solder Cu6Sn5 IMCs layer are formed at the interface of the Cu/solder joint. Cu3Sn IMCs are formed after 10 minutes reflow due to the limited supply of Sn from the Sn-Pb solder. The wettability of Sn-Zn solder is found as least compared with the other solders. The size of Zn platelets is increased with an increase of reflow time for the Sn-Zn solder system. In the case of Sn-Zn-Bi solder, Bi offers significant effects on growth rate of IMCs as well as size and distribution of Zn-rich phase in the β-Sn matrix. No Cu-Sn IMCs are found in the Sn-Zn based solder during 20 minutes reflow, Cu-Zn IMCs act as a good diffusion barrier for Sn. The consumption of Cu by all types of solders are ranked as Sn-Zn-Bi>Sn-Zn>Sn-Pb. Although Sn-Zn-Bi solder has higher dissolution rate of Cu layer and some voids are found at the interface, it can be used as a replacement of conventional Sn-Pb solder in the electronic industry. © 2005 IEEE.
AB - The world is moving toward 'green products' for electronic devices and components due to toxicity of Pb. In this paper two types of solder paste such as Sn-9Zn (eutectic) and Sn-8Zn-3Bi (noneutectic) have been investigated along with Sn-37Pb (eutectic) solder for reference. The variation of dissolution of Cu layer and IMCs with reflow time shows different characteristics for eutectic and non-eutectic solder pastes. The morphologies of the IMCs are quite different for different solder compositions. During as reflowed, the growth rate of IMCs in the Sn-Zn based solder is higher than the Sn-Pb solders. Different types of IMCs such as γ- Cu5Zn8, β-CuZn and thin unknown Cu-Zn layer are formed in the Sn-Zn based solder but in case of Sn-Pb solder Cu6Sn5 IMCs layer are formed at the interface of the Cu/solder joint. Cu3Sn IMCs are formed after 10 minutes reflow due to the limited supply of Sn from the Sn-Pb solder. The wettability of Sn-Zn solder is found as least compared with the other solders. The size of Zn platelets is increased with an increase of reflow time for the Sn-Zn solder system. In the case of Sn-Zn-Bi solder, Bi offers significant effects on growth rate of IMCs as well as size and distribution of Zn-rich phase in the β-Sn matrix. No Cu-Sn IMCs are found in the Sn-Zn based solder during 20 minutes reflow, Cu-Zn IMCs act as a good diffusion barrier for Sn. The consumption of Cu by all types of solders are ranked as Sn-Zn-Bi>Sn-Zn>Sn-Pb. Although Sn-Zn-Bi solder has higher dissolution rate of Cu layer and some voids are found at the interface, it can be used as a replacement of conventional Sn-Pb solder in the electronic industry. © 2005 IEEE.
KW - Dissolution of Cu
KW - Intermetallics
KW - Sn-Zn based solders
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U2 - 10.1109/AGEC.2005.1452341
DO - 10.1109/AGEC.2005.1452341
M3 - RGC 32 - Refereed conference paper (with host publication)
VL - 2005
SP - 178
EP - 184
BT - Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
T2 - 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
Y2 - 15 March 2005 through 18 March 2005
ER -
