Weaker bonding can give larger thermal conductance at highly mismatched interfaces

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Bin Xu
  • Shiqian Hu
  • Shih-Wei Hung
  • Cheng Shao
  • Harsh Chandra
  • Takashi Kodama
  • Junichiro Shiomi

Detail(s)

Original languageEnglish
Article numbereabf8197
Journal / PublicationScience Advances
Volume7
Issue number17
Online published23 Apr 2021
Publication statusPublished - Apr 2021

Link(s)

Abstract

Thermal boundary conductance is typically positively correlated with interfacial adhesion at the interface. Here, we demonstrate a counterintuitive experimental result in which a weak van der Waals interface can give a higher thermal boundary conductance than a strong covalently bonded interface. This occurs in a system with highly mis matched vibrational frequencies (copper/diamond) modified by a self-Assembled monolayer. Using finely con trolled fabrication and detailed characterization, complemented by molecular simulation, the effects of bridging the vibrational spectrum mismatch and bonding at the interface are systematically varied and understood from a molecular dynamics viewpoint. The results reveal that the bridging and binding effects have a trade-off relationship and, consequently, that the bridging can overwhelm the binding effect at a highly mismatched interface. This study provides a comprehensive understanding of phonon transport at interfaces, unifying physical and chemical understandings, and allowing interfacial tailoring of the thermal transport in various material systems.

Research Area(s)

Citation Format(s)

Weaker bonding can give larger thermal conductance at highly mismatched interfaces. / Xu, Bin; Hu, Shiqian; Hung, Shih-Wei; Shao, Cheng; Chandra, Harsh; Chen, Fu-Rong; Kodama, Takashi; Shiomi, Junichiro.

In: Science Advances, Vol. 7, No. 17, eabf8197, 04.2021.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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