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Weaker bonding can give larger thermal conductance at highly mismatched interfaces

  • Bin Xu
  • , Shiqian Hu
  • , Shih-Wei Hung
  • , Cheng Shao
  • , Harsh Chandra
  • , Fu-Rong Chen
  • , Takashi Kodama
  • , Junichiro Shiomi*
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

81 Downloads (CityUHK Scholars)

Abstract

Thermal boundary conductance is typically positively correlated with interfacial adhesion at the interface. Here, we demonstrate a counterintuitive experimental result in which a weak van der Waals interface can give a higher thermal boundary conductance than a strong covalently bonded interface. This occurs in a system with highly mis matched vibrational frequencies (copper/diamond) modified by a self-Assembled monolayer. Using finely con trolled fabrication and detailed characterization, complemented by molecular simulation, the effects of bridging the vibrational spectrum mismatch and bonding at the interface are systematically varied and understood from a molecular dynamics viewpoint. The results reveal that the bridging and binding effects have a trade-off relationship and, consequently, that the bridging can overwhelm the binding effect at a highly mismatched interface. This study provides a comprehensive understanding of phonon transport at interfaces, unifying physical and chemical understandings, and allowing interfacial tailoring of the thermal transport in various material systems.
Original languageEnglish
Article numbereabf8197
JournalScience Advances
Volume7
Issue number17
Online published23 Apr 2021
DOIs
Publication statusPublished - Apr 2021

Publisher's Copyright Statement

  • This full text is made available under CC-BY-NC 4.0. https://creativecommons.org/licenses/by-nc/4.0/

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