Void reduction in autoclave processing of thermoset composites: Part 2 : Void reduction in a microwave curing process

F. Y. C. BOEY; S. W. LYE

doi:10.1016/0010-4361(92)90187-Y

Author(s)

F. Y. C. BOEY
S. W. LYE

Detail(s)

Original language	English
Pages (from-to)	266-270
Journal / Publication	Composites
Volume	23
Issue number	4
Publication status	Published - Jul 1992
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1016/0010-4361(92)90187-Y Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-0001181581&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(44ce5045-f55b-472a-bcdd-e42b7fea7e24).html

Abstract

Microwave curing of thermoset composites has been experimentally shown to be both feasible and viable. There are, however, additional problems when the process is applied industrially such as maximization of the glass transition temperature and reduction of the void content. This paper attempts to explain how the reduction of void content can be achieved in microwave curing, by means of a modified approach involving vacuum bagging and applied autoclave pressure. © 1992 Butterworth-Heinemann Ltd

Research Area(s)

autoclave processing, composite materials, glass transition temperature, microwave curing, pressurization, thermosetting resins, vacuum bagging, void content

Citation Format(s)

[ RIS ] [ BibTeX ]

Void reduction in autoclave processing of thermoset composites: Part 2 : Void reduction in a microwave curing process. / BOEY, F. Y. C.; LYE, S. W.
In: Composites, Vol. 23, No. 4, 07.1992, p. 266-270.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

BOEY, FYC & LYE, SW 1992, 'Void reduction in autoclave processing of thermoset composites: Part 2 : Void reduction in a microwave curing process', Composites, vol. 23, no. 4, pp. 266-270. https://doi.org/10.1016/0010-4361(92)90187-Y

BOEY, F. Y. C., & LYE, S. W. (1992). Void reduction in autoclave processing of thermoset composites: Part 2 : Void reduction in a microwave curing process. Composites, 23(4), 266-270. https://doi.org/10.1016/0010-4361(92)90187-Y

BOEY FYC, LYE SW. Void reduction in autoclave processing of thermoset composites: Part 2 : Void reduction in a microwave curing process. Composites. 1992 Jul;23(4):266-270. doi: 10.1016/0010-4361(92)90187-Y

BOEY, F. Y. C. ; LYE, S. W. / Void reduction in autoclave processing of thermoset composites : Part 2 : Void reduction in a microwave curing process. In: Composites. 1992 ; Vol. 23, No. 4. pp. 266-270.

Void reduction in autoclave processing of thermoset composites : Part 2 : Void reduction in a microwave curing process