Abstract
In this paper we report on the development of a new type of electrostatic actuator, called the Vertical Comb Array Microactuator (VCAM). Using a trench refill technology, and combining bulk silicon and surface polysilicon micromachining we create in/out actuation perpendicular to the wafer surface. This exploits both technologies and enables sub-micron gaps between drive electrodes to provide useful high-throw linear drive previously unattainable in the vertical direction. The VCAM can achieve deflections of up to 8μm, using actuators with 10μm high, 100μm long and 1.5μm wide beams, and with 1μm gap separation from the opposite drive electrodes. Deflections of several microns were achieved with a 25V applied voltage on fabricated devices.
Original language | English |
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Title of host publication | Proceedings of the IEEE Micro Electro Mechanical Systems |
Publisher | IEEE |
Pages | 43-48 |
Publication status | Published - 1995 |
Externally published | Yes |
Event | Proceedings of the 1995 IEEE Micro Electro Mechanical Systems Conference - Amsterdam, Neth Duration: 29 Jan 1995 → 2 Feb 1995 |
Conference
Conference | Proceedings of the 1995 IEEE Micro Electro Mechanical Systems Conference |
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City | Amsterdam, Neth |
Period | 29/01/95 → 2/02/95 |