一種三維多孔碳包裹硅的複合負極材料及其制備方法
Composite Negative Material Adopting Three-dimensional Porous Carbon to Coat Silicon And Preparation Method Thereof
Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53) › 51_Patents granted (CityU only, data source from KTO)
Author(s)
Related Research Unit(s)
Detail(s)
Original language | Chinese (Traditional) |
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Patent number | ZL201610297819.8 |
Filing number | 201610297819.8 |
Publication status |
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Link(s)
Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(ac0b9cdc-1e86-4514-8567-4c33103d02d1).html |
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Citation Format(s)
一種三維多孔碳包裹硅的複合負極材料及其制備方法. / ZHANG, Wenjun (Inventor); ZOU, Rujia (Inventor); YUEN, Muk Fung (Inventor).
Patent No.: ZL201610297819.8. Aug 14, 2020.Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53) › 51_Patents granted (CityU only, data source from KTO)