一種三維多孔碳包裹硅的複合負極材料及其制備方法

Composite Negative Material Adopting Three-dimensional Porous Carbon to Coat Silicon And Preparation Method Thereof

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

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Author(s)

  • Wenjun ZHANG (Inventor)
  • Rujia ZOU (Inventor)
  • Muk Fung YUEN (Inventor)

Detail(s)

Original languageChinese (Traditional)
Patent numberZL201610297819.8
Filing number201610297819.8
Publication status
  • Accepted/In press/Filed - 6 May 2016
  • Published - 14 Aug 2020

Citation Format(s)

一種三維多孔碳包裹硅的複合負極材料及其制備方法. / ZHANG, Wenjun (Inventor); ZOU, Rujia (Inventor); YUEN, Muk Fung (Inventor).

Patent No.: ZL201610297819.8. Aug 14, 2020.

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)