Unique phase changes induced by electromigration (EM) in solder joints

H. Gan; G. Xu; K. N. Tu

doi:10.1109/ectc.2003.1216259

Unique phase changes induced by electromigration (EM) in solder joints

H. Gan, G. Xu, K. N. Tu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

5 Citations (Scopus)

Abstract

Electromigration has been a key and persistent reliability problem in microelectronic technology. It involves both atomic flux and electron flux whose distribution in interconnects is most important concerning electromigration damage. Comparing with Al and Cu interconnects, eutectic solders are two-phase alloys with higher atomic diffusivity. In this article, the unique features of solder joints electromigration will be discussed with emphasis on the effects of current crowding, eutectic composition, polarity effect on chemical reaction and solder composition.

Original language	English
Pages (from-to)	71-76
Journal	Proceedings - Electronic Components and Technology Conference
DOIs	https://doi.org/10.1109/ectc.2003.1216259
Publication status	Published - 2003
Externally published	Yes
Event	53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States Duration: 27 May 2003 → 30 May 2003

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Unique phase changes induced by electromigration (EM) in solder joints",

abstract = "Electromigration has been a key and persistent reliability problem in microelectronic technology. It involves both atomic flux and electron flux whose distribution in interconnects is most important concerning electromigration damage. Comparing with Al and Cu interconnects, eutectic solders are two-phase alloys with higher atomic diffusivity. In this article, the unique features of solder joints electromigration will be discussed with emphasis on the effects of current crowding, eutectic composition, polarity effect on chemical reaction and solder composition.",

author = "H. Gan and G. Xu and Tu, {K. N.}",

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AU - Gan, H.

AU - Xu, G.

AU - Tu, K. N.

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PY - 2003

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N2 - Electromigration has been a key and persistent reliability problem in microelectronic technology. It involves both atomic flux and electron flux whose distribution in interconnects is most important concerning electromigration damage. Comparing with Al and Cu interconnects, eutectic solders are two-phase alloys with higher atomic diffusivity. In this article, the unique features of solder joints electromigration will be discussed with emphasis on the effects of current crowding, eutectic composition, polarity effect on chemical reaction and solder composition.

AB - Electromigration has been a key and persistent reliability problem in microelectronic technology. It involves both atomic flux and electron flux whose distribution in interconnects is most important concerning electromigration damage. Comparing with Al and Cu interconnects, eutectic solders are two-phase alloys with higher atomic diffusivity. In this article, the unique features of solder joints electromigration will be discussed with emphasis on the effects of current crowding, eutectic composition, polarity effect on chemical reaction and solder composition.

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DO - 10.1109/ectc.2003.1216259

M3 - RGC 21 - Publication in refereed journal

SN - 0569-5503

SP - 71

EP - 76

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - 53rd Electronic Components and Technology Conference 2003

Y2 - 27 May 2003 through 30 May 2003

ER -

Unique phase changes induced by electromigration (EM) in solder joints

Abstract

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