Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Hsiang-Yao Hsiao
  • Chien-Min Liu
  • Han-Wen Lin
  • Tao-Chi Liu
  • Chia-Ling Lu
  • Yi-Sa Huang
  • Chih Chen

Detail(s)

Original languageEnglish
Pages (from-to)1007-1010
Journal / PublicationScience
Volume336
Issue number6084
Publication statusPublished - 25 May 2012
Externally publishedYes

Abstract

Highly oriented [111] Cu grains with densely packed nanotwins have been fabricated by direct-current electroplating with a high stirring rate. The [111]-oriented and nanotwinned Cu (nt-Cu) allow for the unidirectional growth of Cu6Sn5 intermetallics in the microbumps of three-dimensional integrated-circuit packaging; a uniform microstructure in a large number of microbumps of controlled orientation can be obtained. The high-density twin boundaries in the nt-Cu serve as vacancy sinks during the solid-state reaction between Pb-free solder and Cu and greatly reduce the formation of Kirkendall (or Frenkel) voids.

Bibliographic Note

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Citation Format(s)

Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper. / Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N.

In: Science, Vol. 336, No. 6084, 25.05.2012, p. 1007-1010.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review