Abstract
Recent advances of miniaturization and microfluidics lead to novel technologies in assembling micro-scale electronic components in thousands and in parallel. Present study proposes a fluidic self-assembly (FSA) approach for fast, economic, and precise handling of micro-scale parts in asymmetric shapes. The micro parts, fabricated from siliconoxide wafers and ranged in size from 350×350×170 μm2 to 1000×1000×440 μm3, are aligned and filled to designated sites in the substrate under water using a pipette. The adhesion force of square-patterned micropart immobilized at the bigger binding sites was estimated at 117 ±15 μ N, resulting in highter assembly yield of up to 73% for these sample. Furthermore, the novel designs of two dimensional tear-drop/rocking-chair like shapes are employed to improve the recovery angle and reduce the energy barrier for micropart alignment in uni-direction. Filling ratio of 90% is achieved with uni-direction if five hundred parts are filled to all of 64 binding sites with the agitation by an orbital shaker. © 2007 IEEE.
| Original language | English |
|---|---|
| Title of host publication | Second International Conference on Innovative Computing, Information and Control, ICICIC 2007 |
| DOIs | |
| Publication status | Published - 2008 |
| Externally published | Yes |
| Event | 2nd International Conference on Innovative Computing, Information and Control, ICICIC 2007 - Kumamoto, Japan Duration: 5 Sept 2007 → 7 Sept 2007 |
Conference
| Conference | 2nd International Conference on Innovative Computing, Information and Control, ICICIC 2007 |
|---|---|
| Place | Japan |
| City | Kumamoto |
| Period | 5/09/07 → 7/09/07 |
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