Undercooling and microstructure analysis for the design of low melting point solder

Li Pu; Yongjun Huo; Xiuchen Zhao; K. N. Tu; Yingxia Liu

doi:10.1109/EDTM50988.2021.9420953

Undercooling and microstructure analysis for the design of low melting point solder

Li Pu
, Yongjun Huo
, Xiuchen Zhao
, K. N. Tu
, Yingxia Liu

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

The undercooling in solidification of eutectic Sn37Pb, Sn3.5Ag, Sn58Bi and Sn52In solders was inspected. Sn37Pb and Sn58Bi have a similar undercooling, around 16 °C, and Sn52In has the lowest undercooling of around 3 °C. The larger the undercooling, the higher the barrier to nucleation. A small undercooling is favorable for solder joint array to solidify at the same time in chip stacking on a packaging substrate.

Original language	English
Title of host publication	2021 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
Publisher	IEEE
ISBN (Electronic)	978-1-7281-8176-9
ISBN (Print)	978-1-7281-8177-6
DOIs	https://doi.org/10.1109/EDTM50988.2021.9420953
Publication status	Published - 2021
Event	5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2021) - Virtual, Chengdu, China Duration: 8 Apr 2021 → 11 Apr 2021 https://ewh.ieee.org/conf/edtm/2021/virtual.html

Publication series

Name	IEEE Electron Devices Technology and Manufacturing Conference, EDTM

Conference

Conference	5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2021)
Place	China
City	Chengdu
Period	8/04/21 → 11/04/21
Internet address	https://ewh.ieee.org/conf/edtm/2021/virtual.html

Research Keywords

electronic packaging
Lead-free solder
nucleation of phase transformations
undercooling

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10.1109/EDTM50988.2021.9420953

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@inproceedings{82a8f40727514fa688ce16440f972920,

title = "Undercooling and microstructure analysis for the design of low melting point solder",

abstract = "The undercooling in solidification of eutectic Sn37Pb, Sn3.5Ag, Sn58Bi and Sn52In solders was inspected. Sn37Pb and Sn58Bi have a similar undercooling, around 16 °C, and Sn52In has the lowest undercooling of around 3 °C. The larger the undercooling, the higher the barrier to nucleation. A small undercooling is favorable for solder joint array to solidify at the same time in chip stacking on a packaging substrate.",

keywords = "electronic packaging, Lead-free solder, nucleation of phase transformations, undercooling",

author = "Li Pu and Yongjun Huo and Xiuchen Zhao and Tu, \{K. N.\} and Yingxia Liu",

year = "2021",

doi = "10.1109/EDTM50988.2021.9420953",

language = "English",

isbn = "978-1-7281-8177-6",

series = "IEEE Electron Devices Technology and Manufacturing Conference, EDTM",

publisher = "IEEE",

booktitle = "2021 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)",

address = "United States",

note = "5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2021) ; Conference date: 08-04-2021 Through 11-04-2021",

url = "https://ewh.ieee.org/conf/edtm/2021/virtual.html",

}

Pu, L, Huo, Y, Zhao, X, Tu, KN & Liu, Y 2021, Undercooling and microstructure analysis for the design of low melting point solder. in 2021 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)., 9420953, IEEE Electron Devices Technology and Manufacturing Conference, EDTM, IEEE, 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2021), Chengdu, China, 8/04/21. https://doi.org/10.1109/EDTM50988.2021.9420953

Undercooling and microstructure analysis for the design of low melting point solder. / Pu, Li; Huo, Yongjun; Zhao, Xiuchen et al.
2021 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM). IEEE, 2021. 9420953 (IEEE Electron Devices Technology and Manufacturing Conference, EDTM).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Undercooling and microstructure analysis for the design of low melting point solder

AU - Pu, Li

AU - Huo, Yongjun

AU - Zhao, Xiuchen

AU - Tu, K. N.

AU - Liu, Yingxia

PY - 2021

Y1 - 2021

N2 - The undercooling in solidification of eutectic Sn37Pb, Sn3.5Ag, Sn58Bi and Sn52In solders was inspected. Sn37Pb and Sn58Bi have a similar undercooling, around 16 °C, and Sn52In has the lowest undercooling of around 3 °C. The larger the undercooling, the higher the barrier to nucleation. A small undercooling is favorable for solder joint array to solidify at the same time in chip stacking on a packaging substrate.

AB - The undercooling in solidification of eutectic Sn37Pb, Sn3.5Ag, Sn58Bi and Sn52In solders was inspected. Sn37Pb and Sn58Bi have a similar undercooling, around 16 °C, and Sn52In has the lowest undercooling of around 3 °C. The larger the undercooling, the higher the barrier to nucleation. A small undercooling is favorable for solder joint array to solidify at the same time in chip stacking on a packaging substrate.

KW - electronic packaging

KW - Lead-free solder

KW - nucleation of phase transformations

KW - undercooling

UR - https://www.scopus.com/pages/publications/85106532063

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85106532063&origin=recordpage

U2 - 10.1109/EDTM50988.2021.9420953

DO - 10.1109/EDTM50988.2021.9420953

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 978-1-7281-8177-6

T3 - IEEE Electron Devices Technology and Manufacturing Conference, EDTM

BT - 2021 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)

PB - IEEE

T2 - 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2021)

Y2 - 8 April 2021 through 11 April 2021

ER -

Undercooling and microstructure analysis for the design of low melting point solder

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