Ultra-thin TaN films as diffusion barriers for Cu metallization

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Material Science

100
Film Material Science
100
Oxidation Reaction Material Science
75
Thin Films Material Science
50
Temperature Material Science
50
Activation Energy Material Science
50
Air Material Science
25
Surface (Surface Sc... Material Science
25
Lining Material Science
25
Phase Composition Material Science

Keyphrases

100
Ultrathin Keyphrases
100
Diffusion Barrier Keyphrases
100
Cu Metallization Keyphrases
100
TaN Film Keyphrases
66
Activation Energy Keyphrases
66
Rutherford Backscat... Keyphrases
66
Backscattering Spec... Keyphrases
66
TaN Thin Film Keyphrases
33
Microstructure Keyphrases
33
Annealing Keyphrases
33
Silica Keyphrases
33
Si Layer Keyphrases
33
Transmission Electr... Keyphrases
33
Scanning Electron M... Keyphrases
33
Elemental Compositi... Keyphrases
33
Oxidation Temperatu... Keyphrases
33
Si Wafer Keyphrases
33
Barrier Layer Keyphrases
33
Reliability Criteri... Keyphrases
33
Cu Film Keyphrases
33
Liner Keyphrases
33
Resistance to Chang... Keyphrases
33
Data Scattering Keyphrases
33
VLSI Technology Keyphrases
33
In Situ Resistance Keyphrases

INIS

100
films INIS
100
diffusion barriers INIS
100
tantalum nitrides INIS
50
oxidation INIS
37
thin films INIS
25
activation energy INIS
25
air INIS
25
rutherford backscat... INIS
25
spectrometers INIS
12
microstructure INIS
12
comparative evaluat... INIS
12
transmission electr... INIS
12
surfaces INIS
12
layers INIS
12
barriers INIS
12
annealing INIS
12
data INIS
12
scanning electron m... INIS
12
thickness INIS
12
scattering INIS
12
reliability INIS
12
barrier layer INIS
12
liners INIS

Engineering

100
Thin Films Engineering
100
Diffusion Barrier Engineering
100
Metallizations Engineering
66
Activation Energy Engineering
66
Temperature Engineering
66
Spectrometer Engineering
33
Surface Engineering
33
Reliability Engineering
33
Thickness Engineering
33
Elemental Compositi... Engineering
33
Si Wafer Engineering
33
Cu Film Engineering
33
Resistance Change Engineering
33
Oxidized Si Engineering
33
Silicon Dioxide Engineering
33
Barrier Layer Engineering

Agricultural and Biological Sciences

100
Oxidation Agricultural and Biologic...
50
Spectrometer Agricultural and Biologic...
50
Temperature Agricultural and Biologic...
25
Surface Agricultural and Biologic...
25
Transmission Electr... Agricultural and Biologic...
25
Scanning Electron M... Agricultural and Biologic...
25
Thickness Agricultural and Biologic...
25
Reliability Agricultural and Biologic...
25
Technology Agricultural and Biologic...
Research OutputsResearch Output authored by Ultra-thin TaN films as diffusion barriers for Cu metallization is tagged with the concept