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Ultra-strength and fracture of metallic and semiconductor nanowires

  • Yang Lu*
  • *Corresponding author for this work

    Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

    Abstract

    In this work, we report our quantitative nanomechanical study of metallic and semiconductor nanowires for their mechanical properties and fracture behavior, by in situ SEM/TEM tensile testing. Ultra-strength phenomenon has been observed for both ultrathin gold nanowires and single crystalline silicon nanowires, while their underlying mechanisms are different. We also discovered different fracture modes for the fractures of ultrathin gold nanowires and elucidated their corresponding mechanisms. While for silicon nanowires, despite ultra-large elasticity, they still failed in typical brittle fracture.
    Original languageEnglish
    Title of host publication14th International Conference on Fracture (ICF-14)
    EditorsEmmanuel E. Gdoutos
    PublisherInternational Conference on Fracture
    Pages1115-1116
    Volume2
    ISBN (Print)9781510878488
    Publication statusPublished - Jun 2017
    Event14th International Conference on Fracture (ICF 14) 2017 - Rhodes, Greece
    Duration: 18 Jun 201723 Jun 2017

    Conference

    Conference14th International Conference on Fracture (ICF 14) 2017
    Abbreviated titleICF14
    PlaceGreece
    CityRhodes
    Period18/06/1723/06/17

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