Two-Dimensional Spatial Construction for Online Modeling of Distributed Parameter Systems
Related Research Unit(s)
|Journal / Publication||IEEE Transactions on Industrial Electronics|
|Online published||15 Feb 2022|
|Publication status||Online published - 15 Feb 2022|
|Link to Scopus||https://www.scopus.com/record/display.uri?eid=2-s2.0-85124832869&origin=recordpage|
A 2-D spatial construction method is proposed for the online modeling of distributed parameter systems (DPSs), such as battery thermal process. The proposed method can combine the advantages of spectral method and Karhunen–Loève decomposition (KLD) method. First, the continuous spatial basis functions are designed by the 2-D spatial construction to keep the information between sensing locations. With the 2-D space-time separation and recursive learning, the derived model can preserve the couplings between spatial dimensions and update over time. The radial basis function network is utilized to identify the low-dimensional temporal dynamics. After the space-time synthesis, the constructed spatiotemporal model can provide continuous modeling of the DPS with satisfactory performance. Convergence analysis has been carried out, which proves that the proposed method can guarantee bounded errors. Finally, simulations and experiments on a pouch-type lithium-ion battery with unknown partial differential equations prove the effectiveness of the proposed method.
- B-spline surface, battery thermal process, Boundary conditions, Distributed parameter system (DPS), Mathematical models, spatial construction, Spatiotemporal phenomena, Splines (mathematics), Surface treatment, Temperature sensors, tensor decomposition, Tensors
IEEE Transactions on Industrial Electronics, Vol. 69, No. 10, 10.2022, p. 10227-10235.
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Wei, P & Li, H-X 2022, 'Two-Dimensional Spatial Construction for Online Modeling of Distributed Parameter Systems', IEEE Transactions on Industrial Electronics, vol. 69, no. 10, pp. 10227-10235. https://doi.org/10.1109/TIE.2022.3150099