TY - JOUR
T1 - Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model
AU - Gao, Si-Ping
AU - De Paulis, Francesco
AU - Liu, En-Xiao
AU - Guo, Yong-Xin
PY - 2019/11
Y1 - 2019/11
N2 - Conventional physics-based via circuit model takes into account the capacitive coupling between via barrel and power/ground plane by a via-plate capacitor, whose calculation relies on a complex expression involving an infinite summation of Hankel functions. In this paper, a capacitor-free via model is proposed and realized by way of a novel transmission line representation of the via-plate capacitance. In particular, the via-plate capacitor is replaced by an open-circuited transmission line (OC-TL) with equal input admittance. The resultant capacitor-free model obviates the need of calculating the sum of infinite series. Instead, it only requires identifying the length of the OC-TL by simple closed-form expressions. Hence, the proposed efficient capacitor-free via model is able to facilitate the modeling of realistic multilayer printed circuit boards (PCBs) and packages. Both numerical and measurement results validate the proposed OC-TL-based via model. © 2019 IEEE.
AB - Conventional physics-based via circuit model takes into account the capacitive coupling between via barrel and power/ground plane by a via-plate capacitor, whose calculation relies on a complex expression involving an infinite summation of Hankel functions. In this paper, a capacitor-free via model is proposed and realized by way of a novel transmission line representation of the via-plate capacitance. In particular, the via-plate capacitor is replaced by an open-circuited transmission line (OC-TL) with equal input admittance. The resultant capacitor-free model obviates the need of calculating the sum of infinite series. Instead, it only requires identifying the length of the OC-TL by simple closed-form expressions. Hence, the proposed efficient capacitor-free via model is able to facilitate the modeling of realistic multilayer printed circuit boards (PCBs) and packages. Both numerical and measurement results validate the proposed OC-TL-based via model. © 2019 IEEE.
KW - Capacitor-free via model
KW - open-circuited transmission line (OC-TL)
KW - power/ground plane
KW - via-plate capacitor
UR - http://www.scopus.com/inward/record.url?scp=85075269573&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85075269573&origin=recordpage
U2 - 10.1109/TCPMT.2019.2926792
DO - 10.1109/TCPMT.2019.2926792
M3 - RGC 21 - Publication in refereed journal
SN - 2156-3950
VL - 9
SP - 2248
EP - 2256
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
IS - 11
ER -