Transient thermal shock fracture analysis of functionally graded piezoelectric materials by the extended finite element method

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Peng Liu
  • Tiantang Yu
  • Tinh Quoc Bui
  • Chuanzeng Zhang
  • Yepeng Xu

Detail(s)

Original languageEnglish
Pages (from-to)2167-2182
Journal / PublicationInternational Journal of Solids and Structures
Volume51
Issue number11-12
Online published6 Mar 2014
Publication statusPublished - 1 Jun 2014

Abstract

Transient thermal dynamic analysis of stationary cracks in functionally graded piezoelectric materials (FGPMs) based on the extended finite element method (X-FEM) is presented. Both heating and cooling shocks are considered. The material properties are supposed to vary exponentially along specific direction while the crack-faces are assumed to be adiabatic and electrically impermeable. A dynamic X-FEM model is developed in which both Crank-Nicolson and Newmark time integration methods are used for calculating transient responses of thermal and electromechanical fields respectively. The generalized dynamic intensity factors for the thermal stresses and electrical displacements are extracted by using the interaction integral. The accuracy of the developed approach is verified numerically by comparing the calculated results with reference solutions. Numerical examples with mixed-mode crack problems are analyzed. The effects of the crack-length, poling direction, material gradation, etc. on the dynamic intensity factors are investigated. It shows that the transient dynamic crack behaviors under the cooling shock differ from those under the heating shock. The influence of the thermal shock loading on the dynamic intensity factors is significant. © 2014 Elsevier Ltd. All rights reserved.

Research Area(s)

  • Dynamic electrical displacement intensity factor, Dynamic fracture, Dynamic thermal stress intensity factors, Functionally graded piezoelectric materials, Thermal shock, X-FEM

Citation Format(s)

Transient thermal shock fracture analysis of functionally graded piezoelectric materials by the extended finite element method. / Liu, Peng; Yu, Tiantang; Bui, Tinh Quoc; Zhang, Chuanzeng; Xu, Yepeng; Lim, Chee Wah.

In: International Journal of Solids and Structures, Vol. 51, No. 11-12, 01.06.2014, p. 2167-2182.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review