To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu

Chih-Chia Hu; Hsiang-Yao Hsiao; Ming-Yung Guo; Chih Chen; K. N. Tu

doi:10.1109/EPTC.2011.6184472

To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu

Chih-Chia Hu
, Hsiang-Yao Hsiao
, Ming-Yung Guo
, Chih Chen^*
, K. N. Tu

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu₆Sn₅ intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMCs was retarded. © 2011 IEEE.

Original language	English
Title of host publication	2011 IEEE 13th Electronics Packaging Technology Conference
Publisher	IEEE
Pages	503-506
ISBN (Electronic)	978-1-4577-1982-0, 978-1-4577-1981-3
ISBN (Print)	9781457719837
DOIs	https://doi.org/10.1109/EPTC.2011.6184472
Publication status	Published - Dec 2011
Externally published	Yes
Event	13th Electronics Packaging Technology Conference (EPTC 2011) - Shangri-La Hotel, Singapore Duration: 7 Dec 2011 → 9 Dec 2011

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Name	IEEE Electronics Packaging Technology Conference, EPTC

Conference

Conference	13th Electronics Packaging Technology Conference (EPTC 2011)
Place	Singapore
Period	7/12/11 → 9/12/11

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10.1109/EPTC.2011.6184472

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@inproceedings{753f05f73a3a4cbab8ec7471661932b8,

title = "To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu",

abstract = "We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu6Sn5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMCs was retarded. {\textcopyright} 2011 IEEE.",

author = "Chih-Chia Hu and Hsiang-Yao Hsiao and Ming-Yung Guo and Chih Chen and Tu, \{K. N.\}",

year = "2011",

month = dec,

doi = "10.1109/EPTC.2011.6184472",

language = "English",

isbn = "9781457719837",

series = "IEEE Electronics Packaging Technology Conference, EPTC",

publisher = "IEEE",

pages = "503--506",

booktitle = "2011 IEEE 13th Electronics Packaging Technology Conference",

address = "United States",

note = "13th Electronics Packaging Technology Conference (EPTC 2011) ; Conference date: 07-12-2011 Through 09-12-2011",

}

Hu, C-C, Hsiao, H-Y, Guo, M-Y, Chen, C & Tu, KN 2011, To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu. in 2011 IEEE 13th Electronics Packaging Technology Conference. IEEE Electronics Packaging Technology Conference, EPTC, IEEE, pp. 503-506, 13th Electronics Packaging Technology Conference (EPTC 2011), Singapore, 7/12/11. https://doi.org/10.1109/EPTC.2011.6184472

To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu. / Hu, Chih-Chia; Hsiao, Hsiang-Yao; Guo, Ming-Yung et al.
2011 IEEE 13th Electronics Packaging Technology Conference. IEEE, 2011. p. 503-506 (IEEE Electronics Packaging Technology Conference, EPTC).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu

AU - Hu, Chih-Chia

AU - Hsiao, Hsiang-Yao

AU - Guo, Ming-Yung

AU - Chen, Chih

AU - Tu, K. N.

PY - 2011/12

Y1 - 2011/12

N2 - We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu6Sn5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMCs was retarded. © 2011 IEEE.

AB - We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu6Sn5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMCs was retarded. © 2011 IEEE.

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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84860901883&origin=recordpage

U2 - 10.1109/EPTC.2011.6184472

DO - 10.1109/EPTC.2011.6184472

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781457719837

T3 - IEEE Electronics Packaging Technology Conference, EPTC

SP - 503

EP - 506

BT - 2011 IEEE 13th Electronics Packaging Technology Conference

PB - IEEE

T2 - 13th Electronics Packaging Technology Conference (EPTC 2011)

Y2 - 7 December 2011 through 9 December 2011

ER -

To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu

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