Titanium-tungsten contacts to Si : The effects of alloying on Schottky contact and on silicide formation
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 6898-6905 |
Journal / Publication | Journal of Applied Physics |
Volume | 53 |
Issue number | 10 |
Publication status | Published - 1982 |
Externally published | Yes |
Link(s)
Abstract
Contact reaction and Schottky barrier heights on Si were studied using Ti-W alloys of increasing W concentration (Ti, Ti8W2, Ti 4W6, Ti2W8) in order to determine the effect of alloy composition on Schottky contact behavior. Glancing angle x-ray diffraction, Rutherford backscattering spectroscopy, and scanning electron microscopy were used to analyze the contact reaction. Schottky barrier heights were determined from the I-V behavior of circular diodes. Four-point probe measurements were used to compute the film electrical resistivity. Our experiments show that the addition of small amounts of W has raised the formation temperature of Ti silicides and maintained a low barrier height (∼0.55 eV) Schottky contact on n-type Si up to 550 °C. A bilayer shallow contact metallurgy Si/Ti8W2/Ti3 W 7/Al which provides a low barrier metal contact to n-type Si as well as an effective diffusion barrier between Al and Si is proposed as a result of this study.
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Citation Format(s)
Titanium-tungsten contacts to Si: The effects of alloying on Schottky contact and on silicide formation. / Babcock, S. E.; Tu, K. N.
In: Journal of Applied Physics, Vol. 53, No. 10, 1982, p. 6898-6905.
In: Journal of Applied Physics, Vol. 53, No. 10, 1982, p. 6898-6905.
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review