Tin repellence on wave-soldering stainless steel holders coated with Ti/TiC/DLC

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

3 Scopus Citations
View graph of relations

Author(s)

  • Shu Xiao
  • Zhongzhen Wu
  • Liangliang Liu
  • Ricky K Y Fu
  • Xiubo Tian
  • Feng Pan

Detail(s)

Original languageEnglish
Pages (from-to)614-618
Journal / PublicationSurface and Coatings Technology
Volume320
Publication statusPublished - 25 Jun 2017

Abstract

Lead-free solder is widely used in the industry, especially in wave soldering. However, the stainless steel holders used in wave soldering are prone to corrosion by the lead-free solder due to increased reactive wetting. Besides, owing to the high affinity between the holders and solder, they are often used to take solder out of the container. To improve tin repellence and the mechanical properties of the stainless steel holders, Ti/TiC and Ti/TiC/DLC coatings are deposited by filtered cathodic vacuum arc (FCVA) and plasma immersion ion implantation and deposition (PIII&D). The morphology, structure, composition, microhardness, wear resistance, electrochemical properties, and wetting characteristics are investigated systematically. The DLC coating, which has an amorphous structure and ID/IG ratio of about 0.55, further enhances the frictional properties, corrosion resistance, and hydrophobic characteristics of the Ti/TiC structure. The surface-modified holders show excellent tin repellence in wave soldering.

Research Area(s)

  • Lead-free soldering, Stainless steel, Ti/TiC/DLC coatings, Tin repellence

Citation Format(s)

Tin repellence on wave-soldering stainless steel holders coated with Ti/TiC/DLC. / Xiao, Shu; Wu, Zhongzhen; Liu, Liangliang; Fu, Ricky K Y; Li, Wan; Tian, Xiubo; Chu, Paul K; Pan, Feng.

In: Surface and Coatings Technology, Vol. 320, 25.06.2017, p. 614-618.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal