Three-dimensional nanosprings for electromechanical sensors

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

62 Scopus Citations
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Author(s)

  • D. J. Bell
  • Y. Sun
  • L. Zhang
  • B. J. Nelson
  • D. Grützmacher

Detail(s)

Original languageEnglish
Pages (from-to)54-61
Journal / PublicationSensors and Actuators, A: Physical
Volume130-131
Online published19 Dec 2005
Publication statusPublished - 14 Aug 2006
Externally publishedYes

Abstract

This paper presents the use of a novel fabrication technique to produce three-dimensional (3D) nanostructures with nanoscale features that can be used for electromechanical sensors. The process uses conventional microfabrication techniques to create a planar pattern in a SiGe/Si bilayer that then self-assembles into 3D structures during a wet etch release. An additional metal layer can be integrated for higher conductivity. Results from the fabrication of the structures are demonstrated. Nanomanipulation inside a scanning electron microscope (SEM) was conducted to probe the structures for mechanical and electrical characterization. The experimental characterization results were validated by finite element simulation.

Research Area(s)

  • Electromechanical sensors, Microfabrication, Nanocoil, Nanofabrication, Nanomanipulation, Nanospring, Self-assembly

Citation Format(s)

Three-dimensional nanosprings for electromechanical sensors. / Bell, D. J.; Sun, Y.; Zhang, L. et al.
In: Sensors and Actuators, A: Physical, Vol. 130-131, 14.08.2006, p. 54-61.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review