TY - JOUR
T1 - Three-dimensional metal patterning over nanostructures by reversal imprint
AU - Peng, C.
AU - Cardozo, B. L.
AU - Pang, S. W.
PY - 2008
Y1 - 2008
N2 - Reversal imprint is used to pattern three-dimensional (3D) metal structures over substrates with complex topography. Metal films are deposited onto SU-8 polymer layers on glass molds, lithographically patterned, and transferred to Si or SU-8 substrates with nanosctructured surfaces by reversal imprint at 5 MPa, 80 °C, and 1 s of UV exposure. The transfer of metal patterns of 5020 nm thick AuTi and 0.5 μm thick Al as well as 3D Al structures have been demonstrated. © 2008 American Vacuum Society.
AB - Reversal imprint is used to pattern three-dimensional (3D) metal structures over substrates with complex topography. Metal films are deposited onto SU-8 polymer layers on glass molds, lithographically patterned, and transferred to Si or SU-8 substrates with nanosctructured surfaces by reversal imprint at 5 MPa, 80 °C, and 1 s of UV exposure. The transfer of metal patterns of 5020 nm thick AuTi and 0.5 μm thick Al as well as 3D Al structures have been demonstrated. © 2008 American Vacuum Society.
UR - http://www.scopus.com/inward/record.url?scp=41549142717&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-41549142717&origin=recordpage
U2 - 10.1116/1.2897319
DO - 10.1116/1.2897319
M3 - RGC 21 - Publication in refereed journal
SN - 0734-211X
VL - 26
SP - 632
EP - 635
JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
IS - 2
ER -