| Translated title of the contribution | 一種基於精粒體架構的可構建三維人工智能處理器的系統設計方案 |
|---|---|
| Original language | English |
| Publication status | Accepted/In press/Filed - 19 Jan 2026 |
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Three-Dimensional Artificial Intelligence Processor Based On Fine-Grainedcube Architecture And Method For Designing The Same
- Yulong CHEN (Inventor)
- , Yingxia LIU (Inventor)
Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)