@article{a2b21435fc524bccb64525f50781c8ec,
title = "Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films",
abstract = "The elastic modulus and hardness of on-wafer low-k dielectric polytetrafluoroethylene films in the thickness range of 48.1 to 1141 nm were studied using the dynamic contact module (DCM) in frequency-specific depth-sensing indentation. Results indicate that the chemical-mechanical polishing (CMP) characteristics of polytetrafluoroethylene films are thickness dependent.",
author = "J. Wang and Shi, {F. G.} and Nieh, {T. G.} and B. Zhao and Brongo, {M. R.} and S. Qu and T. Rosenmayer",
note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to
[email protected].",
year = "2000",
month = mar,
day = "17",
doi = "10.1016/S1359-6462(99)00421-2",
language = "English",
volume = "42",
pages = "687--694",
journal = "Scripta Materialia",
issn = "1359-6462",
publisher = "Acta Materialia Inc",
number = "7",
}