Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films

J. Wang; F. G. Shi; T. G. Nieh; B. Zhao; M. R. Brongo; S. Qu; T. Rosenmayer

doi:10.1016/S1359-6462(99)00421-2

Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films

J. Wang
, F. G. Shi
, T. G. Nieh
, B. Zhao
, M. R. Brongo
, S. Qu
, T. Rosenmayer

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

62 Citations (Scopus)

Abstract

The elastic modulus and hardness of on-wafer low-k dielectric polytetrafluoroethylene films in the thickness range of 48.1 to 1141 nm were studied using the dynamic contact module (DCM) in frequency-specific depth-sensing indentation. Results indicate that the chemical-mechanical polishing (CMP) characteristics of polytetrafluoroethylene films are thickness dependent.

Original language	English
Pages (from-to)	687-694
Journal	Scripta Materialia
Volume	42
Issue number	7
DOIs	https://doi.org/10.1016/S1359-6462(99)00421-2
Publication status	Published - 17 Mar 2000
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films",

abstract = "The elastic modulus and hardness of on-wafer low-k dielectric polytetrafluoroethylene films in the thickness range of 48.1 to 1141 nm were studied using the dynamic contact module (DCM) in frequency-specific depth-sensing indentation. Results indicate that the chemical-mechanical polishing (CMP) characteristics of polytetrafluoroethylene films are thickness dependent.",

author = "J. Wang and Shi, \{F. G.\} and Nieh, \{T. G.\} and B. Zhao and Brongo, \{M. R.\} and S. Qu and T. Rosenmayer",

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language = "English",

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TY - JOUR

T1 - Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films

AU - Wang, J.

AU - Shi, F. G.

AU - Nieh, T. G.

AU - Zhao, B.

AU - Brongo, M. R.

AU - Qu, S.

AU - Rosenmayer, T.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2000/3/17

Y1 - 2000/3/17

N2 - The elastic modulus and hardness of on-wafer low-k dielectric polytetrafluoroethylene films in the thickness range of 48.1 to 1141 nm were studied using the dynamic contact module (DCM) in frequency-specific depth-sensing indentation. Results indicate that the chemical-mechanical polishing (CMP) characteristics of polytetrafluoroethylene films are thickness dependent.

AB - The elastic modulus and hardness of on-wafer low-k dielectric polytetrafluoroethylene films in the thickness range of 48.1 to 1141 nm were studied using the dynamic contact module (DCM) in frequency-specific depth-sensing indentation. Results indicate that the chemical-mechanical polishing (CMP) characteristics of polytetrafluoroethylene films are thickness dependent.

UR - https://www.scopus.com/pages/publications/0033891587

UR - https://www.scopus.com/pages/publications/0033891587#tab=impact

U2 - 10.1016/S1359-6462(99)00421-2

DO - 10.1016/S1359-6462(99)00421-2

M3 - RGC 21 - Publication in refereed journal

SN - 1359-6462

VL - 42

SP - 687

EP - 694

JO - Scripta Materialia

JF - Scripta Materialia

IS - 7

ER -

Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films

Abstract

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