Thick-film lithography using laser write

Y. Cheng; T. Huang; C. C. Chieng

doi:10.1007/s00542-002-0201-y

Thick-film lithography using laser write

Y. Cheng, T. Huang, C. C. Chieng

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

11 Citations (Scopus)

Abstract

Mask-making process by laser direct-write has been broadly applied in the microelectronics and the PC board industries. In this paper, we report the thick-film lithography of laser write mainly for the X-ray mask in the LIGA application. Several schemes of multiple writing are successfully demonstrated in terms of the sidewall straightness and free from intensity fluctuation of laser light. Present study adopts the applications of the positive resist of AZ P4620 prepared with a thickness of 30 μm, anti-reflection coating of AZ BARLi II on the substrate, and intensity filler to achieve smooth and straight sidewalls. © Springer-Verlag 2002.

Original language	English
Pages (from-to)	17-22
Journal	Microsystem Technologies
Volume	9
Issue number	1-2
DOIs	https://doi.org/10.1007/s00542-002-0201-y
Publication status	Published - 2003
Externally published	Yes

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abstract = "Mask-making process by laser direct-write has been broadly applied in the microelectronics and the PC board industries. In this paper, we report the thick-film lithography of laser write mainly for the X-ray mask in the LIGA application. Several schemes of multiple writing are successfully demonstrated in terms of the sidewall straightness and free from intensity fluctuation of laser light. Present study adopts the applications of the positive resist of AZ P4620 prepared with a thickness of 30 μm, anti-reflection coating of AZ BARLi II on the substrate, and intensity filler to achieve smooth and straight sidewalls. {\textcopyright} Springer-Verlag 2002.",

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T1 - Thick-film lithography using laser write

AU - Cheng, Y.

AU - Huang, T.

AU - Chieng, C. C.

PY - 2003

Y1 - 2003

N2 - Mask-making process by laser direct-write has been broadly applied in the microelectronics and the PC board industries. In this paper, we report the thick-film lithography of laser write mainly for the X-ray mask in the LIGA application. Several schemes of multiple writing are successfully demonstrated in terms of the sidewall straightness and free from intensity fluctuation of laser light. Present study adopts the applications of the positive resist of AZ P4620 prepared with a thickness of 30 μm, anti-reflection coating of AZ BARLi II on the substrate, and intensity filler to achieve smooth and straight sidewalls. © Springer-Verlag 2002.

AB - Mask-making process by laser direct-write has been broadly applied in the microelectronics and the PC board industries. In this paper, we report the thick-film lithography of laser write mainly for the X-ray mask in the LIGA application. Several schemes of multiple writing are successfully demonstrated in terms of the sidewall straightness and free from intensity fluctuation of laser light. Present study adopts the applications of the positive resist of AZ P4620 prepared with a thickness of 30 μm, anti-reflection coating of AZ BARLi II on the substrate, and intensity filler to achieve smooth and straight sidewalls. © Springer-Verlag 2002.

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DO - 10.1007/s00542-002-0201-y

M3 - RGC 21 - Publication in refereed journal

SN - 0946-7076

VL - 9

SP - 17

EP - 22

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 1-2

ER -

Thick-film lithography using laser write

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