Thermomigration in SnPb composite flip chip solder joints

Annie T. Huang; A. M. Gusak; K. N. Tu; Yi-Shao Lai

doi:10.1063/1.2192694

Thermomigration in SnPb composite flip chip solder joints

Annie T. Huang
, A. M. Gusak
, K. N. Tu
, Yi-Shao Lai

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

164 Citations (Scopus)

Abstract

We have used composite flip chip solder joints to study thermomigration. The composite solder joint has 97Pb3Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Redistribution of Sn and Pb occurs in thermomigration, and we found that Sn has moved to the Si side (the hot end) and Pb to the substrate side (the cold end). We estimate the driving force that a temperature gradient of 1000 °Ccm or a temperature difference of 10 °C across a solder joint of 100 μm in diameter is sufficient to induce the thermomigration. © 2006 American Institute of Physics.

Original language	English
Article number	141911
Journal	Applied Physics Letters
Volume	88
Issue number	14
DOIs	https://doi.org/10.1063/1.2192694
Publication status	Published - 3 Apr 2006
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Thermomigration in SnPb composite flip chip solder joints",

abstract = "We have used composite flip chip solder joints to study thermomigration. The composite solder joint has 97Pb3Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Redistribution of Sn and Pb occurs in thermomigration, and we found that Sn has moved to the Si side (the hot end) and Pb to the substrate side (the cold end). We estimate the driving force that a temperature gradient of 1000 °Ccm or a temperature difference of 10 °C across a solder joint of 100 μm in diameter is sufficient to induce the thermomigration. {\textcopyright} 2006 American Institute of Physics.",

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AU - Huang, Annie T.

AU - Gusak, A. M.

AU - Tu, K. N.

AU - Lai, Yi-Shao

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2006/4/3

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N2 - We have used composite flip chip solder joints to study thermomigration. The composite solder joint has 97Pb3Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Redistribution of Sn and Pb occurs in thermomigration, and we found that Sn has moved to the Si side (the hot end) and Pb to the substrate side (the cold end). We estimate the driving force that a temperature gradient of 1000 °Ccm or a temperature difference of 10 °C across a solder joint of 100 μm in diameter is sufficient to induce the thermomigration. © 2006 American Institute of Physics.

AB - We have used composite flip chip solder joints to study thermomigration. The composite solder joint has 97Pb3Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Redistribution of Sn and Pb occurs in thermomigration, and we found that Sn has moved to the Si side (the hot end) and Pb to the substrate side (the cold end). We estimate the driving force that a temperature gradient of 1000 °Ccm or a temperature difference of 10 °C across a solder joint of 100 μm in diameter is sufficient to induce the thermomigration. © 2006 American Institute of Physics.

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M3 - RGC 21 - Publication in refereed journal

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VL - 88

JO - Applied Physics Letters

JF - Applied Physics Letters

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M1 - 141911

ER -

Thermomigration in SnPb composite flip chip solder joints

Abstract

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