Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints

Tian Tian; K. N. Tu; Hsiao-Yun Chen; Hsiang-Yao Hsiao; Chih Chen

doi:10.1002/9781119966203.ch17

Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints

Tian Tian, K. N. Tu, Hsiao-Yun Chen, Hsiang-Yao Hsiao, Chih Chen

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 12 - Chapter in an edited book (Author) › peer-review

Original language	English
Title of host publication	Lead‐Free Solders
Subtitle of host publication	Materials Reliability for Electronics
Editors	K. N. Subramanian
Publisher	John Wiley & Sons
Pages	425-442
ISBN (Electronic)	9781119966203
ISBN (Print)	9780470971826
DOIs	https://doi.org/10.1002/9781119966203.ch17
Publication status	Published - 2012
Externally published	Yes

Research Keywords

3D FEA, in solder bumps
Pb free thermomigration
Soret effect
Thermomigration in SnPb
Thermomigration issues
TM, and reliability problem

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10.1002/9781119966203.ch17

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title = "Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints",

keywords = "3D FEA, in solder bumps, Pb free thermomigration, Soret effect, Thermomigration in SnPb, Thermomigration issues, TM, and reliability problem",

author = "Tian Tian and Tu, {K. N.} and Hsiao-Yun Chen and Hsiang-Yao Hsiao and Chih Chen",

year = "2012",

doi = "10.1002/9781119966203.ch17",

language = "English",

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T1 - Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints

AU - Tian, Tian

AU - Tu, K. N.

AU - Chen, Hsiao-Yun

AU - Hsiao, Hsiang-Yao

AU - Chen, Chih

PY - 2012

Y1 - 2012

KW - 3D FEA, in solder bumps

KW - Pb free thermomigration

KW - Soret effect

KW - Thermomigration in SnPb

KW - Thermomigration issues

KW - TM, and reliability problem

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U2 - 10.1002/9781119966203.ch17

DO - 10.1002/9781119966203.ch17

M3 - RGC 12 - Chapter in an edited book (Author)

SN - 9780470971826

SP - 425

EP - 442

BT - Lead‐Free Solders

A2 - Subramanian, K. N.

PB - John Wiley & Sons

ER -

Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints

Research Keywords

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