Thermoelastic dissipation in etch-hole filled Lamé bulk-mode silicon microresonators

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Article number6144691
Pages (from-to)450-452
Journal / PublicationIEEE Electron Device Letters
Issue number3
Publication statusPublished - Mar 2012


The perforation of a Lamé bulk-mode silicon mechanical resonator via uniformly distributed etch holes has been observed to drastically reduce the quality factor (Q) by over 90%. The cause of this sharp drop remains largely unknown. A high Q is important, while etch holes are commonly used in the fabrication of resonators. This letter traces the cause to thermoelastic dissipation through the use of finite-element analysis based on coupled thermoelastic equations. The results from the analysis are well corroborated by data from measurements of fabricated silicon-on-insulator devices. © 2012 IEEE.

Research Area(s)

  • Bulk acoustic wave devices, etch holes, micromechanical resonator, quality factor