TY - GEN
T1 - Thermodynamic assessment of Sn-Co-Cu lead-free solder alloy
AU - Liu, Libin
AU - Andersson, Cristina
AU - Liu, Johan
AU - Chan, Y. C.
PY - 2003
Y1 - 2003
N2 - To select a lead-free solder system, factors such as eutectic/peritectic point, electron negativity, abundance, cost, toxicity of elements, world production capacity, segregation during solidification, possibility to form low melting phases with Pb, among others must be carefully considered. On the basis of thorough analysis of binary phase diagrams of Sn-X-systems (X represents other elements) and the properties of the element X, the Sn-Co-Cu eutectic ternary alloy system has been chosen as a new lead-free solder candidate. In order to find the eutectic point for the Sn-Co-Cu system, the Sn-Co binary system was thoroughly assessed with CALPHAD (CALculation of PHAse Diagram) methods. The ternary phase diagram of Sn-Co-Cu system was extrapolated with the assessed thermodynamic parameters of Sn-Co, Sn-Cu, and Co-Cu system. The eutectic point for L -Sn2Co+(Sn)+Cu6Sn5 is 224.4°C and 0.37%Co and 0.68%Cu and 98.95%Sn.
AB - To select a lead-free solder system, factors such as eutectic/peritectic point, electron negativity, abundance, cost, toxicity of elements, world production capacity, segregation during solidification, possibility to form low melting phases with Pb, among others must be carefully considered. On the basis of thorough analysis of binary phase diagrams of Sn-X-systems (X represents other elements) and the properties of the element X, the Sn-Co-Cu eutectic ternary alloy system has been chosen as a new lead-free solder candidate. In order to find the eutectic point for the Sn-Co-Cu system, the Sn-Co binary system was thoroughly assessed with CALPHAD (CALculation of PHAse Diagram) methods. The ternary phase diagram of Sn-Co-Cu system was extrapolated with the assessed thermodynamic parameters of Sn-Co, Sn-Cu, and Co-Cu system. The eutectic point for L -Sn2Co+(Sn)+Cu6Sn5 is 224.4°C and 0.37%Co and 0.68%Cu and 98.95%Sn.
KW - CALPHAD
KW - Lead-free solder
KW - Phase diagram
KW - Sn-Co-Cu
UR - http://www.scopus.com/inward/record.url?scp=1242264773&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-1242264773&origin=recordpage
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 791836908
VL - 1
SP - 141
EP - 145
BT - Advances in Electronic Packaging
T2 - 2003 International Electronic Packaging Technical Conference and Exhibition
Y2 - 6 July 2003 through 11 July 2003
ER -