Thermal-mechanical interface crack behaviour of a surface mount solder joint

C. M L Wu; J. K L Lai; Yong-Li Wu

doi:10.1016/S0168-874X(98)00028-6

Author(s)

Detail(s)

Original language	English
Pages (from-to)	19-30
Journal / Publication	Finite Elements in Analysis and Design
Volume	30
Issue number	1-2
Publication status	Published - 15 Jul 1998

Link(s)

DOI	DOI https://doi.org/10.1016/S0168-874X(98)00028-6 Final Published version
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Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-0032117141&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(b0c8acac-5719-45f8-a374-e7d55da068ca).html

Abstract

The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis. The thermal effect was taken as cooling from the solder eutectic temperature to room temperature. Mechanical loading at the ends of the PCB was also applied. The results showed that cooling had the effect of causing large residual shear displacement at the region near the interface cracks. The mechanical loading caused additional crack opening displacements. The analysis on the values of J-integral for the interface cracks showed that J-integral was approximately path independent, and that the effect of crack at the solder/PCB interface is much more serious than that between the component and solder. © 1998 Elsevier Science B.V. All rights reserved.

Research Area(s)

Finite element analysis, Interface crack, J-integral, Lead-tin solder joint, Thermal-mechanical analysis

Citation Format(s)

[ RIS ] [ BibTeX ]

Thermal-mechanical interface crack behaviour of a surface mount solder joint. / Wu, C. M L ; Lai, J. K L; Wu, Yong-Li.
In: Finite Elements in Analysis and Design, Vol. 30, No. 1-2, 15.07.1998, p. 19-30.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Wu, CML , Lai, JKL & Wu, Y-L 1998, 'Thermal-mechanical interface crack behaviour of a surface mount solder joint', Finite Elements in Analysis and Design, vol. 30, no. 1-2, pp. 19-30. https://doi.org/10.1016/S0168-874X(98)00028-6

Wu, C. M. L., Lai, J. K. L., & Wu, Y.-L. (1998). Thermal-mechanical interface crack behaviour of a surface mount solder joint. Finite Elements in Analysis and Design, 30(1-2), 19-30. https://doi.org/10.1016/S0168-874X(98)00028-6

Wu CML , Lai JKL, Wu YL. Thermal-mechanical interface crack behaviour of a surface mount solder joint. Finite Elements in Analysis and Design. 1998 Jul 15;30(1-2):19-30. doi: 10.1016/S0168-874X(98)00028-6

Wu, C. M L ; Lai, J. K L ; Wu, Yong-Li. / Thermal-mechanical interface crack behaviour of a surface mount solder joint. In: Finite Elements in Analysis and Design. 1998 ; Vol. 30, No. 1-2. pp. 19-30.