Thermal-mechanical interface crack behaviour of a surface mount solder joint

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Original languageEnglish
Pages (from-to)19-30
Journal / PublicationFinite Elements in Analysis and Design
Issue number1-2
Publication statusPublished - 15 Jul 1998


The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis. The thermal effect was taken as cooling from the solder eutectic temperature to room temperature. Mechanical loading at the ends of the PCB was also applied. The results showed that cooling had the effect of causing large residual shear displacement at the region near the interface cracks. The mechanical loading caused additional crack opening displacements. The analysis on the values of J-integral for the interface cracks showed that J-integral was approximately path independent, and that the effect of crack at the solder/PCB interface is much more serious than that between the component and solder. © 1998 Elsevier Science B.V. All rights reserved.

Research Area(s)

  • Finite element analysis, Interface crack, J-integral, Lead-tin solder joint, Thermal-mechanical analysis