Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Material Science

100
Temperature Material Science
100
Nanocrystalline Material Science
25
Thermal Stability Material Science
25
Electronic Circuit Material Science
25
Tensile Testing Material Science
25
Fracture Behavior Material Science
25
Ductile Fracture Material Science

Keyphrases

100
Low Temperature Keyphrases
100
Thermal Instability Keyphrases
100
Nanocrystalline Cu Keyphrases
100
Cu-Cu Bonding Keyphrases
66
Bonding Interface Keyphrases
33
Annealing Keyphrases
33
Randomly Oriented Keyphrases
33
Thermal Stability Keyphrases
33
Interfacial Region Keyphrases
33
Orientation Control Keyphrases
33
Sn-Cu Keyphrases
33
Cu-Sn Keyphrases
33
Micro-tensile Test Keyphrases
33
Low-temperature Bon... Keyphrases
33
Mechanical Integrit... Keyphrases
33
3D IC Keyphrases
33
Cu Interlayer Keyphrases
33
Cu Interconnect Keyphrases
33
Packaging Method Keyphrases
33
High Integrity Keyphrases
33
Low Temperature Cu ... Keyphrases
33
Ductile Fracture Be... Keyphrases

INIS

100
bonding INIS
100
low temperature INIS
100
instability INIS
25
interfaces INIS
12
orientation INIS
12
control INIS
12
stability INIS
12
annealing INIS
12
testing INIS
12
applications INIS
12
fractures INIS
12
integrated circuits INIS
12
packaging INIS

Engineering

100
Nanocrystalline Engineering
100
Low-Temperature Engineering
100
Interconnects Engineering
100
Direct Bonding Engineering
25
Interlayer Engineering
25
Potential Applicati... Engineering
25
Fracture Behavior Engineering
25
Tensile Testing Engineering
25
Microscale Engineering
25
Ductile Fracture Engineering
25
Interfacial Region Engineering
25
Three Dimensional I... Engineering
Research OutputsResearch Output authored by Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature is tagged with the concept