Thermal fatigue analysis of surface mounted soldered joints
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
Author(s)
Detail(s)
Original language | English |
---|---|
Title of host publication | American Society of Mechanical Engineers, Petroleum Division (Publication) PD |
Publisher | Publ by ASME |
Pages | 667-671 |
Volume | 64 |
ISBN (print) | 791812804 |
Publication status | Published - 1994 |
Publication series
Name | |
---|---|
Volume | 64 |
Conference
Title | Proceedings of the 2nd Biennial European Joint Conference on Engineering Systems Design and Analysis. Part 1 (of 8) |
---|---|
City | London, Engl |
Period | 4 - 7 July 1994 |
Link(s)
Abstract
A surface mounted soldered joint assembly was analyzed using a finite element formulation for the thermal fatigue behaviour of the joint. A fatigue criterion which is based on the stresses in the assembly and the basic material fatigue parameters was used. To model thermal fatigue in the assembly, thermal effects were included in the formulation. Eutectic solder material was used in the analysis. The formulation is capable of predicting fatigue in terms of numbers of cycles to failure at all nodes in the finite element mesh. The minimum number of cycles to failure of all nodes was taken as the number of cycles to failure for the assembly. The Results were presented in number of cycles to failure in the solder joint at various temperature ranges. It was found that the number of cycles to failure generally increased with the decrease in temperature range.
Citation Format(s)
Thermal fatigue analysis of surface mounted soldered joints. / Wu, C. M Lawrence.
American Society of Mechanical Engineers, Petroleum Division (Publication) PD. Vol. 64 Publ by ASME, 1994. p. 667-671.
American Society of Mechanical Engineers, Petroleum Division (Publication) PD. Vol. 64 Publ by ASME, 1994. p. 667-671.
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review