Thermal cycling effects in Cu-Zn-Al shape memory alloy by positron lifetime measurementS

G. M. Lin; J. K L Lai; C. Y. Chung

doi:10.1016/0956-716X(95)00030-Y

Thermal cycling effects in Cu-Zn-Al shape memory alloy by positron lifetime measurementS

G. M. Lin, J. K L Lai, C. Y. Chung

Research output: Journal Publications and Reviews › RGC 22 - Publication in policy or professional journal

8 Citations (Scopus)

Abstract

The present paper shows that Mf and As of CuZuAl shape memory material will decrease with increasing number of thermal cycles, while Ms and Af remain constant. On the other hand, the thermal hysteresis will decrease and the shape memory strain will remain constant. The thermal cycling behaviour is closely related to the formation of vacancy clusters by vacancy agglomeration. © 1995.

Original language	English
Pages (from-to)	1865-1869
Journal	Scripta Metallurgica et Materiala
Volume	32
Issue number	11
DOIs	https://doi.org/10.1016/0956-716X(95)00030-Y
Publication status	Published - 1 Jun 1995

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title = "Thermal cycling effects in Cu-Zn-Al shape memory alloy by positron lifetime measurementS",

abstract = "The present paper shows that Mf and As of CuZuAl shape memory material will decrease with increasing number of thermal cycles, while Ms and Af remain constant. On the other hand, the thermal hysteresis will decrease and the shape memory strain will remain constant. The thermal cycling behaviour is closely related to the formation of vacancy clusters by vacancy agglomeration. {\textcopyright} 1995.",

author = "Lin, {G. M.} and Lai, {J. K L} and Chung, {C. Y.}",

year = "1995",

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T1 - Thermal cycling effects in Cu-Zn-Al shape memory alloy by positron lifetime measurementS

AU - Lin, G. M.

AU - Lai, J. K L

AU - Chung, C. Y.

PY - 1995/6/1

Y1 - 1995/6/1

N2 - The present paper shows that Mf and As of CuZuAl shape memory material will decrease with increasing number of thermal cycles, while Ms and Af remain constant. On the other hand, the thermal hysteresis will decrease and the shape memory strain will remain constant. The thermal cycling behaviour is closely related to the formation of vacancy clusters by vacancy agglomeration. © 1995.

AB - The present paper shows that Mf and As of CuZuAl shape memory material will decrease with increasing number of thermal cycles, while Ms and Af remain constant. On the other hand, the thermal hysteresis will decrease and the shape memory strain will remain constant. The thermal cycling behaviour is closely related to the formation of vacancy clusters by vacancy agglomeration. © 1995.

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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0029325153&origin=recordpage

U2 - 10.1016/0956-716X(95)00030-Y

DO - 10.1016/0956-716X(95)00030-Y

M3 - RGC 22 - Publication in policy or professional journal

SN - 0956-716X

VL - 32

SP - 1865

EP - 1869

JO - Scripta Metallurgica et Materiala

JF - Scripta Metallurgica et Materiala

IS - 11

ER -

Thermal cycling effects in Cu-Zn-Al shape memory alloy by positron lifetime measurementS

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