TY - GEN
T1 - Thermal cycling analysis of TAB OLB connection with ACF
AU - Yeung, N. H.
AU - Wu, C. M.L.
AU - Lai, J. K.L.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 1998
Y1 - 1998
N2 - This paper reports on the numerical prediction of the deformations and stresses in an anisotropic conductive film (ACF) for connection between the outer lead bonds (OLB) of a tape automated bonded (TAB) assembly and a glass panel. First, the ACF was bonded to the glass panel under heat and pressure and the whole assembly was cooled to room temperature. At this point, a very small residual stress existed. After that, the OLB of the TAB assembly, consisting of copper leads and a polyimide film, were bonded to the ACF. During the bonding process, large stress concentrations were found and the ACF experienced large deformations. The ACF and OLB finally merged together due to the heat and the pressure. This phenomenon is in good agreement with examinations of OLB using a scanning electron microscope. Similar to the pre-bonding process procedure, the assembly was allowed to cool to room temperature. The residual stress obtained was small. After the simulation of the manufacturing process above, thermal cycling from -25°C to 125°C was applied to the assembly. Von Mises stress distributions were obtained. The results provided useful information on the effects of thermal cycling on the TAB OLB with ACF.
AB - This paper reports on the numerical prediction of the deformations and stresses in an anisotropic conductive film (ACF) for connection between the outer lead bonds (OLB) of a tape automated bonded (TAB) assembly and a glass panel. First, the ACF was bonded to the glass panel under heat and pressure and the whole assembly was cooled to room temperature. At this point, a very small residual stress existed. After that, the OLB of the TAB assembly, consisting of copper leads and a polyimide film, were bonded to the ACF. During the bonding process, large stress concentrations were found and the ACF experienced large deformations. The ACF and OLB finally merged together due to the heat and the pressure. This phenomenon is in good agreement with examinations of OLB using a scanning electron microscope. Similar to the pre-bonding process procedure, the assembly was allowed to cool to room temperature. The residual stress obtained was small. After the simulation of the manufacturing process above, thermal cycling from -25°C to 125°C was applied to the assembly. Von Mises stress distributions were obtained. The results provided useful information on the effects of thermal cycling on the TAB OLB with ACF.
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U2 - 10.1109/ADHES.1998.742028
DO - 10.1109/ADHES.1998.742028
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 0780349342
SN - 9780780349346
VL - 1998-September
T3 - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
SP - 206
EP - 210
BT - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
PB - IEEE
T2 - 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998
Y2 - 28 September 1998 through 30 September 1998
ER -
