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Theoretically revisiting structural thermal armor for efficient Leidenfrost effect inhabitation

  • Mingyu Li
  • , Wei Wang
  • , Mengnan Jiang
  • , Huaduo Gu
  • , Yuchao Li
  • , Hangchen Liu
  • , Penghao Duan
  • , Baoping Zhang*
  • , Zuankai Wang*
  • *Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Abstract

Inhibiting Leidenfrost effect to enhance heat transfer is crucial yet a formidable challenge, particularly at extremely high temperatures. Previously, we developed a heterogeneous structural thermal armor (STA) that fundamentally inhibits Leidenfrost effect even over 1000 °C by integrating thermally insulating porous membranes into thermally conductive metal pillars. Despite this, there are still some unrevealed mechanisms underlying the efficient heat transfer of heterogeneous STA that are beyond the current experimental capacity, as exemplified by the invisible formation of vapor layer. Herein, we extended the understanding of heat transfer of STA by conducting a theoretical simulation using a combination of the volume of fraction model and the Lee phase change model. We revealed the critical role of surface free energy of porous membrane in promoting wettability, evaporation, and particularly the vapor evacuation dynamics of heterogeneous STA. This work not only advances our fundamental understanding of Leidenfrost effect inhabitation but also provides insight on designing heterogeneous STA with optimal heat transfer efficiency. © 2026 Author(s).
Original languageEnglish
Article number011418
Number of pages10
JournalApplied Physics Reviews
Volume13
Issue number1
Online published12 Feb 2026
DOIs
Publication statusPublished - Mar 2026

Funding

We acknowledge financial support from the National Natural Science Foundation of China (Grant Nos. T2293694, 52333015, and 11215523); the National Key Research and Development Program of China (No. 2023YFE0209900); the Research Grants Council of Hong Kong (Nos. 15237824, SRFS2223-1S01, 11215523, and N_PolyU5172/24); funding support from the Hong Kong Polytechnic University (No. P0052886); the Innovation and Technology Commission of Hong Kong (No. MHP/025/23); the Research, Academic and Industry Sectors One-Plus Scheme (Raise+, No. RAI/23/1/094A), the National Natural Science Foundation of China (Grant Nos. 52576059 and T2550276); the Fundamental Research Funds for the Central Universities DUT24RC(3)036; and the Xiaomi Young Talents Program.

RGC Funding Information

  • RGC-funded

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