The microstructure and mechanical property of the high entropy alloy as a low temperature solder

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

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Author(s)

  • Li Pu
  • Xiuchen Zhao
  • Zhuangzhuang Hou
  • K. N. Tu
  • Yingia Liu

Detail(s)

Original languageEnglish
Title of host publicationProceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
PublisherIEEE
Pages1716-1721
ISBN (Electronic)978-1-7281-1499-6
Publication statusPublished - 1 May 2019

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2019-May
ISSN (Print)0569-5503

Conference

Title69th IEEE Electronic Components and Technology Conference, ECTC 2019
PlaceUnited States
CityLas Vegas
Period28 - 31 May 2019

Abstract

In this paper, we studied the high entropy alloy (HEA) of SnBiInZn as a low temperature solder with a melting point about 80 oC. The microstructure of the HEA solder is very complicated. There are three phases at least in the solder, including Bi-rich phase, Sn-rich phase and InBi phase. The wetting reaction between the solder and Cu substrate was conducted at 100 oC and 120 oC. The wetting angle ranges from 30 to 40 degrees, indicating that the solder has a good wetting ability even at such low soldering temperature. The scallop and finger shape intermetallic compounds were determined to be Cu6Sn5. The thickness measurement of the IMC layer shows that the interfacial reaction rate is very slow. The shear stress ranges from 19 MPa to 28 MPa, which indicates that the solder joint is strong enough for electronic packaging technology.

Research Area(s)

  • Entropy alloy, Intermetallic compound, Low temperature solder, Microstructure, Shear stress

Citation Format(s)

The microstructure and mechanical property of the high entropy alloy as a low temperature solder. / Pu, Li; He, Quanfeng; Yang, Yong; Zhao, Xiuchen; Hou, Zhuangzhuang; Tu, K. N.; Liu, Yingia.

Proceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019. p. 1716-1721 8811294 (Proceedings - Electronic Components and Technology Conference; Vol. 2019-May).

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review