The microstructure and mechanical property of the high entropy alloy as a low temperature solder

Li Pu; Quanfeng He; Yong Yang; Xiuchen Zhao; Zhuangzhuang Hou; K. N. Tu; Yingxia Liu

doi:10.1109/ECTC.2019.00263

The microstructure and mechanical property of the high entropy alloy as a low temperature solder

Li Pu, Quanfeng He, Yong Yang, Xiuchen Zhao, Zhuangzhuang Hou, K. N. Tu, Yingxia Liu^*

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

9 Citations (Scopus)

Abstract

In this paper, we studied the high entropy alloy (HEA) of SnBiInZn as a low temperature solder with a melting point about 80 °C. The microstructure of the HEA solder is very complicated. There are three phases at least in the solder, including Bi-rich phase, Sn-rich phase and InBi phase. The wetting reaction between the solder and Cu substrate was conducted at 100 °C and 120 °C. The wetting angle ranges from 30 to 40 degrees, indicating that the solder has a good wetting ability even at such low soldering temperature. The scallop and finger shape intermetallic compounds were determined to be Cu₆Sn₅. The thickness measurement of the IMC layer shows that the interfacial reaction rate is very slow. The shear stress ranges from 19 MPa to 28 MPa, which indicates that the solder joint is strong enough for electronic packaging technology.

Original language	English
Title of host publication	Proceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Publisher	IEEE
Pages	1716-1721
ISBN (Electronic)	978-1-7281-1499-6, 978-1-7281-1498-9
ISBN (Print)	978-1-7281-1500-9
DOIs	https://doi.org/10.1109/ECTC.2019.00263
Publication status	Published - 2020
Event	69th IEEE Electronic Components and Technology Conference (ECTC 2019) - The Cosmopolitan of Las Vegas, Las Vegas, United States Duration: 28 May 2019 → 31 May 2019 https://www.ectc.net/about/69highlights.cfm

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503
ISSN (Electronic)	2377-5726

Conference

Conference	69th IEEE Electronic Components and Technology Conference (ECTC 2019)
Place	United States
City	Las Vegas
Period	28/05/19 → 31/05/19
Internet address	https://www.ectc.net/about/69highlights.cfm

Research Keywords

Entropy alloy
Intermetallic compound
Low temperature solder
Microstructure
Shear stress

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10.1109/ECTC.2019.00263

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Pu, L., He, Q., Yang, Y., Zhao, X., Hou, Z., Tu, K. N., & Liu, Y. (2020). The microstructure and mechanical property of the high entropy alloy as a low temperature solder. In Proceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 1716-1721). Article 8811294 (Proceedings - Electronic Components and Technology Conference). IEEE. https://doi.org/10.1109/ECTC.2019.00263

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title = "The microstructure and mechanical property of the high entropy alloy as a low temperature solder",

abstract = "In this paper, we studied the high entropy alloy (HEA) of SnBiInZn as a low temperature solder with a melting point about 80 °C. The microstructure of the HEA solder is very complicated. There are three phases at least in the solder, including Bi-rich phase, Sn-rich phase and InBi phase. The wetting reaction between the solder and Cu substrate was conducted at 100 °C and 120 °C. The wetting angle ranges from 30 to 40 degrees, indicating that the solder has a good wetting ability even at such low soldering temperature. The scallop and finger shape intermetallic compounds were determined to be Cu6Sn5. The thickness measurement of the IMC layer shows that the interfacial reaction rate is very slow. The shear stress ranges from 19 MPa to 28 MPa, which indicates that the solder joint is strong enough for electronic packaging technology.",

keywords = "Entropy alloy, Intermetallic compound, Low temperature solder, Microstructure, Shear stress",

author = "Li Pu and Quanfeng He and Yong Yang and Xiuchen Zhao and Zhuangzhuang Hou and Tu, {K. N.} and Yingxia Liu",

year = "2020",

doi = "10.1109/ECTC.2019.00263",

language = "English",

isbn = "978-1-7281-1500-9",

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publisher = "IEEE",

pages = "1716--1721",

booktitle = "Proceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)",

address = "United States",

note = "69th IEEE Electronic Components and Technology Conference (ECTC 2019) ; Conference date: 28-05-2019 Through 31-05-2019",

url = "https://www.ectc.net/about/69highlights.cfm",

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Pu, L, He, Q , Yang, Y, Zhao, X, Hou, Z, Tu, KN & Liu, Y 2020, The microstructure and mechanical property of the high entropy alloy as a low temperature solder. in Proceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)., 8811294, Proceedings - Electronic Components and Technology Conference, IEEE, pp. 1716-1721, 69th IEEE Electronic Components and Technology Conference (ECTC 2019), Las Vegas, Nevada, United States, 28/05/19. https://doi.org/10.1109/ECTC.2019.00263

The microstructure and mechanical property of the high entropy alloy as a low temperature solder. / Pu, Li; He, Quanfeng ; Yang, Yong et al.
Proceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2020. p. 1716-1721 8811294 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - The microstructure and mechanical property of the high entropy alloy as a low temperature solder

AU - Pu, Li

AU - He, Quanfeng

AU - Yang, Yong

AU - Zhao, Xiuchen

AU - Hou, Zhuangzhuang

AU - Tu, K. N.

AU - Liu, Yingxia

PY - 2020

Y1 - 2020

N2 - In this paper, we studied the high entropy alloy (HEA) of SnBiInZn as a low temperature solder with a melting point about 80 °C. The microstructure of the HEA solder is very complicated. There are three phases at least in the solder, including Bi-rich phase, Sn-rich phase and InBi phase. The wetting reaction between the solder and Cu substrate was conducted at 100 °C and 120 °C. The wetting angle ranges from 30 to 40 degrees, indicating that the solder has a good wetting ability even at such low soldering temperature. The scallop and finger shape intermetallic compounds were determined to be Cu6Sn5. The thickness measurement of the IMC layer shows that the interfacial reaction rate is very slow. The shear stress ranges from 19 MPa to 28 MPa, which indicates that the solder joint is strong enough for electronic packaging technology.

AB - In this paper, we studied the high entropy alloy (HEA) of SnBiInZn as a low temperature solder with a melting point about 80 °C. The microstructure of the HEA solder is very complicated. There are three phases at least in the solder, including Bi-rich phase, Sn-rich phase and InBi phase. The wetting reaction between the solder and Cu substrate was conducted at 100 °C and 120 °C. The wetting angle ranges from 30 to 40 degrees, indicating that the solder has a good wetting ability even at such low soldering temperature. The scallop and finger shape intermetallic compounds were determined to be Cu6Sn5. The thickness measurement of the IMC layer shows that the interfacial reaction rate is very slow. The shear stress ranges from 19 MPa to 28 MPa, which indicates that the solder joint is strong enough for electronic packaging technology.

KW - Entropy alloy

KW - Intermetallic compound

KW - Low temperature solder

KW - Microstructure

KW - Shear stress

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M3 - RGC 32 - Refereed conference paper (with host publication)

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T3 - Proceedings - Electronic Components and Technology Conference

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BT - Proceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

PB - IEEE

T2 - 69th IEEE Electronic Components and Technology Conference (ECTC 2019)

Y2 - 28 May 2019 through 31 May 2019

ER -

Pu L, He Q , Yang Y, Zhao X, Hou Z, Tu KN et al. The microstructure and mechanical property of the high entropy alloy as a low temperature solder. In Proceedings - The 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE. 2020. p. 1716-1721. 8811294. (Proceedings - Electronic Components and Technology Conference). Epub 2019 Aug 26. doi: 10.1109/ECTC.2019.00263

The microstructure and mechanical property of the high entropy alloy as a low temperature solder

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