The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach

Zhi Jin*, Fupeng Huo, Duy Le Han, Xunda Liu, Hiroaki Tatsumi, Y.C. Chan, Hiroshi Nishikawa*

*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

3 Citations (Scopus)

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Material Science

Chemical Engineering