The Effects of Sintering Temperature and Addition of TiH2 on the Sintering Process of Cu

Huali Hao, Yanjing Wang, Hamid Reza Jafari Nodooshan, Yongyun Zhang, Shulong Ye, Yonghu Lv, Peng Yu*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

12 Citations (Scopus)
29 Downloads (CityUHK Scholars)

Abstract

In this study, effects of sintering temperature and TiH2 on the sintering process of Cu are investigated. During sintering, the oxide in Cu decomposes and generates oxygen, which can become trapped in the material forming closed pores. Therefore, this results in low sintered density. Sintering behavior of Cu can be significantly improved by adding 0.5 wt.% TiH2 which decomposes during sintering, producing hydrogen and effectively reducing the oxide in Cu. Although gas products of the reduction reaction may still be trapped inside the close pores formed near the TiH2 particles and handicap the sintering of Cu, an isothermal treatment at 650 °C can avoid forming close pores. This allows reaction products to dissipate freely from the sample, subsequently increasing its sintered density.

Original languageEnglish
Article number2594
JournalMaterials
Volume12
Issue number16
Online published15 Aug 2019
DOIs
Publication statusPublished - Aug 2019
Externally publishedYes

Funding

Funding: This work was supported by the Shenzhen Science and Technology Innovation Committee (grant numbers SGLH20161212155758670 and KQJSCX20180322152424539), and “Climbing Program” Special Funds (grant number pdjh2017c0007). Acknowledgments: The authors thank the support from the Shenzhen Science and Technology Innovation Committee (grant number SGLH20161212155758670 and KQJSCX20180322152424539), and “Climbing Program” Special Funds (grant number pdjh2017c0007).

Research Keywords

  • Copper
  • Oxygen content
  • Powder metallurgy
  • Sintering behavior
  • TiH

Publisher's Copyright Statement

  • This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/

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