The effect of immersion Sn coating on the electromigration failure mechanism and lifetimes of Cu dual damascene interconnects

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Material Science

100
Coating Material Science
100
Dielectric Material Material Science
40
Surface Treatment Material Science
40
Cathode Material Science
40
Grain Boundaries Material Science
20
Nucleation Material Science
20
Density Material Science
20
Characterization Material Science
20
Scanning Electron M... Material Science
20
Surface Diffusion Material Science
20
Linewidth Material Science
20
Focused Ion Beam Material Science

Keyphrases

100
Failure Mechanism Keyphrases
100
Electromigration Keyphrases
100
Damascene Interconn... Keyphrases
100
Dual Damascene Keyphrases
100
Sn Coating Keyphrases
100
Failure Life Keyphrases
37
Dielectric Keyphrases
25
Surface Treatment Keyphrases
25
Failure Analysis Keyphrases
25
Dielectric Interfac... Keyphrases
25
Cu-Sn Bonding Keyphrases
12
Nucleate Keyphrases
12
Order of Magnitude Keyphrases
12
Grain Boundary Keyphrases
12
In Situ Keyphrases
12
Current Density Keyphrases
12
Capping Layer Keyphrases
12
Failure Time Keyphrases
12
Electron Flow Keyphrases
12
Submicron Keyphrases
12
Agglomeration Keyphrases
12
Grain Boundary Diff... Keyphrases
12
Cross-sectional Ima... Keyphrases
12
Surface Diffusion Keyphrases
12
Diffusion Path Keyphrases
12
Package Level Keyphrases
12
Void nucleation Keyphrases
12
Upper Layer Keyphrases
12
Lower Layer Keyphrases
12
Median Time Keyphrases
12
Cu Interconnect Keyphrases
12
Diffuse Failure Keyphrases

INIS

100
failures INIS
100
coatings INIS
100
lifetime INIS
100
electromigration INIS
62
dielectrics INIS
62
interfaces INIS
50
voids INIS
37
diffusion INIS
25
growth INIS
25
bonding INIS
25
layers INIS
25
grain boundaries INIS
25
surface treatments INIS
25
cathodes INIS
12
levels INIS
12
control INIS
12
surfaces INIS
12
electrons INIS
12
deposition INIS
12
images INIS
12
nucleation INIS
12
scanning electron m... INIS
12
current density INIS
12
impedance INIS
12
line widths INIS
12
agglomeration INIS

Engineering

100
Interconnects Engineering
100
Failure Mechanism Engineering
100
Electromigration Engineering
100
Dual Damascene Engineering
62
Dielectrics Engineering
25
Surface Engineering
25
Failure Analysis Engineering
12
Micron Engineering
12
Control Sample Engineering
12
Failure (Mechanical... Engineering
12
Line Width Engineering
12
Grain Boundary Diff... Engineering
12
Diffusion Path Engineering
12
Test Structure Engineering
12
Cap Layer Engineering
12
Lower Layer Engineering
12
Experiment Engineering
12
Images Engineering
12
Density Engineering
12
Grain Boundaries Engineering

Chemical Engineering

100
Surface Diffusion Chemical Engineering
Research OutputsResearch Output authored by The effect of immersion Sn coating on the electromigration failure mechanism and lifetimes of Cu dual damascene interconnects is tagged with the concept