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The effect of immersion Sn coating on the electromigration failure mechanism and lifetimes of Cu dual damascene interconnects
Minyu Yan, King-Ning Tu, Anand V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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(Scopus)